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Advanced Electronics Packaging Digest

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SEMI Europe, Polish-Taiwanese Chamber Partner to Boost Poland’s Semiconductor Growth

03/16/2026 | SEMI
SEMI Europe announced the signing of a new two‑year Memorandum of Understanding (MoU) with the Polish‑Taiwanese Chamber of Commerce, establishing a strategic partnership to advance semiconductor industry development and support the green transition across the sector.

Geopolitics Reshapes PCB Industry as TPCA Leads Taiwan–U.S. Push at APEX EXPO 2026

02/09/2026 | TPCA
To help Taiwanese businesses seize opportunities arising from supply chain restructuring and capitalize on the US's central position in the global market, the Taiwan Printed Circuit Association (TPCA) will host a special "Taiwan High-End Packaging Exhibition Zone" at APEX EXPO 2026, the world's premier PCB event, from March 17-19 in Anaheim, California.

Taming AI's Hunger for Data: Using The Smallest Technology Nodes For Energy-Efficient AI

12/02/2025 | Fraunhofer
Artificial intelligence works fast, but its energy consumption is growing rapidly. A German-Taiwanese research team is now developing a solution: new memory for leading chip technologies smaller than 3 nm.

CTCI to Join Foxconn, TEEMA in Global Science Park Initiative

11/25/2025 | PRNewswire
Taiwan's leading engineering, procurement, and construction (EPC) services provider CTCI announced that it will collaborate with Foxconn (Hon Hai Precision Industry Company) and TEEMA (Taiwan Electrical and Electronic Manufacturers' Association) on an initiative to set up "TEEMA Science Parks" overseas, leveraging CTCI's EPC capabilities and experiences in building low-carbon industry parks, factories, and industrial plants.

Foxconn Honored For Investor Relations Excellence In IR Magazine Awards

12/06/2024 | PRNewswire
Hon Hai Technology Group, the world's largest electronics manufacturing service provider, has been honored as winner of investor relations excellence in three major categories – Best In Sector, Best IR Officer, and Best Use Of Technology Including AI – in 2024 awards by IR Magazine, the globally recognized, definitive, independent voice in investor relations.
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