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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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VeCS HDI Process Technology: Has the Time Come for Broader Adoption?

08/25/2026 | Joan Tourné, NextGin Technology
Packaging technology has always driven the PCB, but today's AI and high-performance computing devices are accelerating that relationship. As compute density, bandwidth, and power requirements increase, package, substrate, and PCB design become more interdependent. Modern AI processors, such as NVIDIA's Blackwell architecture, require thousands of package connections, support multiple stacks of high-bandwidth memory (HBM), and can dissipate as much as 1,000 watts of power or more. These demands are driving new approaches to package substrates, redistribution layers (RDLs), thermal management, and PCB fabrication, where manufacturing itself is becoming a limiting factor.

3 Key Takeaways: Factory Analytics Turns Data Into Action

08/17/2026 | I-Connect007
Every electronics manufacturer generates data. The challenge is knowing what to do with it. In The Printed Circuit Assembler's Guide to... Factory Analytics, Julie Cliche-Dubois of Cogiscan explains how manufacturers can transform disconnected machine data into meaningful insights that improve productivity, quality, and profitability. Rather than focusing on analytics as an IT initiative, the book demonstrates how factory-wide visibility empowers everyone, from line operators to quality managers, to make smarter decisions.

Powering the Future: From Substrate to System—The Power Module Assembly

08/19/2026 | Brian Buyea -- Column: Powering the Future
If you ask 10 engineers what “assembly” means in electronics, you’ll likely get 10 variations of the same answer: placing components on a board and soldering them down. That definition might work for traditional PCB-based electronics, but in high-power, high-reliability systems, it falls short by a mile.

Marvell Advances AI Memory Infrastructure Portfolio to Accelerate Agentic AI Inference

08/14/2026 | Marvell Technology, Inc.
Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced new innovations across its AI memory infrastructure portfolio, advancing its position spanning server-level AI storage, rack-scale CXL memory expansion and pooling, and pod-level optical shared memory.

Below the Surface: Why Thermal Failure Is Still the No. 1 Killer in Power Electronics

08/18/2026 | Chandra Gupta -- Column: Below the Surface
Why do power electronics fail? There’s a range of answers, from overvoltage and mechanical stress to poor assembly and environmental exposure. If you ask your favorite AI search engine for an answer, you’ll get a pretty simple response: excessive temperature leads to component degradation, material breakdown, and eventual failure. In a sense, that’s true, but it’s oversimplified and incomplete. The real issue is thermal management failure at the system level. Heat is still the number one killer, and most of the time, you don’t even realize it’s there.
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