Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
It’s Only Common Sense: Selling During an Economic Downturn
Marcy’s Musings: Can You Hear the Voices?
New Book Highlights Approaches to Ensure Reliability in Your Assembly Process
December 18, 2019 | I-Connect007Estimated reading time: 1 minute
Learn how to ensure electrochemical reliability with The Printed Circuit Assembler’s Guide to… Process Validation—the latest title in our educational library. The Printed Circuit Assembler’s Guide to… is an ongoing series dedicated to educating those in the circuit board assembly sector, and serves as a valuable resource for electronics industry professionals seeking the most relevant information available.
Given the current trends toward smart infrastructures, industrial internet of things (IIoT), and connected and electric vehicles, electronic circuit boards are deployed into humid and potentially corrosive environments arguably to a greater extent than ever before; hence, they are at greater risk of failures due to electrochemical migration (ECM). Graham Naisbitt of Gen3 explores how establishing acceptable electrochemical reliability of the bare board can be achieved by using both CAF testing and SIR testing.
Dr. Lothar Henneken, senior expert and Six Sigma Blackbelt, automotive electronics at Robert Bosch GmbH, says, “The development of humidity-robust electronic components represents a central task of reliability engineering in view of increasing miniaturization, extended operating times (e.g., autonomous driving), and increasing loads (e.g., e-mobility). Suitable material selection, characterization, and qualification—with the help of CAF and SIR tests—are an important part of this, as is ensuring constant manufacturing processes; the control of which can be carried out by means of regular ionic contamination measurements, in addition to a quality management system.
Dr. Henneken continues, “This book is an excellent reflection of the current state of experts' views on the subject. Recent changes in IPC and IEC documents are explained in an understandable way. Many misinterpretations and emotional views, especially on ionic contamination measurement, are cleared up in a simple manner. The frequently recurring questions about influencing variables on SIR and CAF tests and their significance for material qualification are also summarized and well-founded.”
This is a must-read for those in the industry who are concerned about ECM—especially in automotive—as well as those who want to adopt a better and more rigorous approach to ensuring electrochemical reliability and deal responsibly with the subject of humidity robustness through new, valid, state-of-the-art material and process qualification.
Download your free copy today! You can also view other titles in our full library.
We hope you enjoy The Printed Circuit Assembler’s Guide to… Process Validation.
For more information, contact:
Barb Hockaday
I-Connect007 eBooks
barb@iconnect007.com
+1-916-365-1727 (GMT-7)
Share on:
Suggested Items
IPC Rising Star Award: Feng Xue, IBM
04/22/2025 | Nolan Johnson, I-Connect007Feng Xue is a senior technical staff member in supply chain engineering at IBM. He has 21 years of experience in semiconductor technology and supply chain operations and leads initiatives on internal quality management systems, supplier quality programs, business analytics, app modernization and cloud-native apps for quality processes, IoT solution deployment, and Industrial 4.0 transformation, engineering skill development, and technical leadership development.
Real Time with... IPC APEX EXPO 2025: Show Wrap Up–A Review with John Mitchell
04/21/2025 | Real Time with...IPC APEX EXPOMarcy LaRont sits down with Dr. John W. Mitchell on the last day of IPC APEX EXPO 2025, marking its 25th anniversary. They highlight the event's success and specifically recognize this year's technical conference and professional development tracks. They also discuss AI's role in electronics, as Mitchell urges professionals to improve their skills around AI to keep themselves valuable and relevant. AI is here to stay! He touches upon tariffs and promotes a diverse supply chain, emphasizing the essential ingredient of collaboration for mutual success. Ending on sustainability, he discusses IPC's launch of the Evolve program showcasing the industry's commitment to sustainability.
Real Time with... IPC APEX EXPO 2025: Empowering the Next Generation—Waad Tarman's Journey as IPC Student Board Member
04/22/2025 | Marcy LaRont, I-Connect007In this conversation, Waad Tarman, a PhD student at Auburn University, reflects on her impactful journey as the outgoing IPC Student Board Member. Having transitioned from a career in project coordination to pursuing advanced studies in industrial and systems engineering, Waad’s dedication to electronics manufacturing shines through. Her experience as a student representative allowed her to engage with industry leaders and provide valuable insights from a student’s perspective. As she prepares to pass the torch to her successor, she shares her key takeaways, emphasizing the importance of connection, communication, and the ethos of paying it forward.
EIPC Summer Conference 2025: PCB Innovation in Edinburgh
04/18/2025 | EIPCEIPC have very wisely selected this wonderful city in Scotland as the venue for their Summer Conference on June 3-4. Whilst delegates will be distilling the proven information imparted by the speakers in the day, in the evening they will be free spirits at the Conference Dinner.
IPC President's Award: Barry Matties
04/21/2025 | Pete Starkey, I-Connect007The IPC President’s Award is given to IPC members who have exhibited ongoing leadership in IPC and have made significant contributions of their time and talent to the association and the electronic interconnect industry. Individuals can receive this award only once. Barry Matties has been a leading global force in publishing content about the electronics industry for nearly 40 years. He began his publishing career as a co-founder of CircuiTree Magazine in 1987, which became the leading printed trade journal serving the PCB industry.