Dan’s Biz Bookshelf: ‘Abundance: How We Build a Better Future’
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
It’s Only Common Sense: The Phone Is Still Your Competitive Advantage
New Book Highlights Approaches to Ensure Reliability in Your Assembly Process
December 18, 2019 | I-Connect007Estimated reading time: 2 minutes
Learn how to ensure electrochemical reliability with The Printed Circuit Assembler’s Guide to… Process Validation—the latest title in our educational library. The Printed Circuit Assembler’s Guide to… is an ongoing series dedicated to educating those in the circuit board assembly sector, and serves as a valuable resource for electronics industry professionals seeking the most relevant information available.
Given the current trends toward smart infrastructures, industrial internet of things (IIoT), and connected and electric vehicles, electronic circuit boards are deployed into humid and potentially corrosive environments arguably to a greater extent than ever before; hence, they are at greater risk of failures due to electrochemical migration (ECM). Graham Naisbitt of Gen3 explores how establishing acceptable electrochemical reliability of the bare board can be achieved by using both CAF testing and SIR testing.
Dr. Lothar Henneken, senior expert and Six Sigma Blackbelt, automotive electronics at Robert Bosch GmbH, says, “The development of humidity-robust electronic components represents a central task of reliability engineering in view of increasing miniaturization, extended operating times (e.g., autonomous driving), and increasing loads (e.g., e-mobility). Suitable material selection, characterization, and qualification—with the help of CAF and SIR tests—are an important part of this, as is ensuring constant manufacturing processes; the control of which can be carried out by means of regular ionic contamination measurements, in addition to a quality management system.
Dr. Henneken continues, “This book is an excellent reflection of the current state of experts' views on the subject. Recent changes in IPC and IEC documents are explained in an understandable way. Many misinterpretations and emotional views, especially on ionic contamination measurement, are cleared up in a simple manner. The frequently recurring questions about influencing variables on SIR and CAF tests and their significance for material qualification are also summarized and well-founded.”
This is a must-read for those in the industry who are concerned about ECM—especially in automotive—as well as those who want to adopt a better and more rigorous approach to ensuring electrochemical reliability and deal responsibly with the subject of humidity robustness through new, valid, state-of-the-art material and process qualification.
Download your free copy today! You can also view other titles in our full library.
We hope you enjoy The Printed Circuit Assembler’s Guide to… Process Validation.
For more information, contact:
Barb Hockaday
I-Connect007 eBooks
barb@iconnect007.com
+1-916-365-1727 (GMT-7)
Share on:
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.