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Grow, Pause, Grow: A Report From SMTA Guadalajara

09/12/2024 | Nolan Johnson, PCB007
Two years ago, the EMS industry in Mexico—spurred by the EV and medical markets, and accelerated by changing trade relations with China—was growing by leaps and bounds. In fact, recently, SMT007 Magazine reported on the near-shoring effects. This week’s SMTA Guadalajara Expo and Tech Forum reflects that growth through the show’s rapid expansion and high-energy enthusiasm.

My Drop Shock Testing Experiments to Determine Reliability in PCBs

08/14/2024 | Palash Vyas, Ph.D, Graduate Research Assistant
Tablets, digital cameras, and smartphones are portable electronics that have become increasingly popular. Compact design and improved functionality are common product and package design trends. However, because they are portable, these devices may fall and cause internal damage. In addition, customers may use products in different environments, exposing them to risks that could cause harm. For example, a smart device such as a phone or tablet could be dropped while being used, or a warehouse shipment could be handled carelessly and fall. Products must have sufficient mechanical shock reliability to reduce the likelihood of damage.

Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 3

08/07/2024 | I-Connect007 Editorial Team
In this chapter, readers learn about the use of HRL3 alloy in solder joints to balance strength and ductility. Test results show improved performance with HRL3 alloy compared to traditional low-temperature solders.

IPC Releases July 2024 Global Sentiment of the Electronics Supply Chain Report

07/24/2024 | IPC
Sentiment among electronics manufacturers slipped in July, dropping to the lowest level in a year. Despite the decline, sentiment remains above its long-term average according to IPC’s July Sentiment of the Global Electronics Manufacturing Supply Chain Report.

Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 2

07/10/2024 | I-Connect007 Editorial Team
The evolution of low-temperature solder alloys requires thoughtful consideration of the thermal and mechanical reliability requirements specific to each application. Thermal cycling and drop (mechanical) shock tests have long been used as board-level proxy tests for evaluating and quantifying the ability of electronics assemblies to sustain abrupt, short-term mechanical stresses, as well as continuous cyclic stresses.
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