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Weak Demand Outlook and Rising Inventory and Supply Pressure DRAM Prices Down for 2025
November 18, 2024 | TrendForceEstimated reading time: 1 minute
The fourth quarter is a critical period for setting DRAM contract prices. TrendForce’s latest research reveals that prices for mature DRAM processes such as DDR4 and LPDDR4X are already trending downward due to ample supply and declining demand. The demand outlook for advanced products like DDR5 and LPDDR5X remains uncertain, and with high inventory levels among certain buyers and sellers, a further drop in prices by the end of Q4 cannot be ruled out.
Avril Wu, TrendForce Senior Vice President of Research, explained that the company had a more optimistic outlook on DRAM prices in 2025, driven by aggressive HBM capacity expansion by the top three suppliers, with new facilities expected to commence full production by 2026.
However, rapid changes in market dynamics have led TrendForce to revise its forecast, shifting from an anticipated price increase to a projected decline, with the first half of 2025 expected to see a particularly pronounced drop. In this trend, DDR4 and LPDDR4X are likely to face more significant downward pressure than DDR5 and LPDDR5X.
On the supply side, the weakening NAND Flash market, which currently offers lower profitability than DRAM, is expected to prompt some production lines to switch from NAND to DRAM. Additionally, while HBM3e 12hi is anticipated to quickly become mainstream for AI applications in 2025, not all suppliers may secure NVIDIA certification on time, increasing the likelihood that TSV capacity could be redirected to conventional DRAM production.
Wu also highlighted that rapid capacity expansion by Chinese suppliers has positioned them as the largest source of DRAM production outside the top three global suppliers. Additionally, ongoing weakness in consumer electronics demand is expected to further impact DRAM pricing in 2025. If manufacturers are unable to effectively manage production levels, inventory clearance across the industry will likely slow down considerably.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/18/2025 | Andy Shaughnessy, Design007 MagazineIt’s been a busy week in our industry. Never a dull moment! If you’ve been paying attention to our tariff tumult with China and its effect on the stock market, especially if your company does a lot of business with China, you might be tempted to call in a Xanax refill about now. But hang tight. This is still early in the first quarter. This brouhaha serves to underscore our need to manufacture critical laminates and components in the U.S. In this week’s must-reads, we have a potpourri of articles covering tariffs, the next generation of HDI, the three-year anniversary of IPC Mexico, a novel green technology, and emerging design trends.
Real Time with... IPC APEX EXPO 2025: Aster–Enhancing Design for Effective Testing Strategies
04/18/2025 | Real Time with...IPC APEX EXPOWill Webb, technical director at Aster, stresses the importance of testability in design, emphasizing early engagement to identify testing issues. This discussion covers the integration of testing with Industry 4.0, the need for good test coverage, and adherence to industry standards. Innovations like boundary scan testing and new tools for cluster testing are introduced, highlighting advancements in optimizing testing workflows and collaboration with other tools.
IPC President’s Award: Xaver Feiner
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New High Power 3D AXI for Power Electronics from Test Research, Inc.
04/17/2025 | TRITest Research, Inc. (TRI), a leading provider of Test and Inspection solutions for the electronics manufacturing industry, proudly announces the launch of the 3D AXI TR7600HP system. Designed for power semiconductor inspection, the TR7600HP enhances accuracy and efficiency in detecting defects in components such as IGBTs, MOSFETs, SiC inverters, and Paladin Connectors.
IPC APEX EXPO 2025 Learning Lounge: Education on the Show Floor
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