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Advanced Electronics Packaging Digest

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Muon Space Expands Leadership Team as Company Scales Constellation Programs

10/19/2026 | Muon Space
Muon Space, the Mission Foundry for high-performance satellite constellations, announced two additions to its leadership team as the company scales production and expands a growing portfolio of commercial and government constellation programs. Jody Kelman has joined Muon as Chief Product Officer, and Emelia Probasco has joined as Head of Strategy and Communications.

HDP, Global Electronics Association Release New Copper Foil Profile Test Method

10/19/2026 | HDP User Group
High Density Packaging User Group (HDP) and the Global Electronics Association are pleased to announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s Non-Contact Copper Foil Profile project.

High Density Packaging User Group and Global Electronics Association Announce New Copper Profile Test Method

10/15/2026 | Global Electronics Association
High Density Packaging User Group (HDP) and the Global Electronics Association announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s Non-Contact Copper Foil Profile project.

SMTA Announces 2026 Stromberg Student Leader Scholarship Recipient

10/09/2026 | SMTA
SMTA is pleased to announce Aditya Amatya, Auburn University, has been selected as the recipient of the 2026 JoAnn Stromberg Student Leader Scholarship.

Global Electronics Association Names Jason Palmi Chief Financial Officer

10/06/2026 | Global Electronics Association
The Global Electronics Association announced that Jason Palmi has joined the organization as Chief Financial Officer.
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