-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Mitsui Mining & Smelting Co. Ltd. to Sell Copper Foil Division to Nippon Denkai, Ltd.
December 20, 2019 | Oak-MitsuiEstimated reading time: 1 minute
Mitsui Mining & Smelting Co., Ltd. (TYO: 5706), a global leader in engineered materials and copper foil for printed circuit applications, announced that it has entered into a definitive agreement to sell the Company's copper foil manufacturing division, known as Oak Mitsui, Inc. (OMI), with locations in Camden, South Carolina and Hoosick Falls, New York, to Nippon Denkai, Ltd., a leader in copper foil manufacturing for lithium ion batteries.
OMI will be transferred in whole to Nippon Denkai, Ltd. pending regulatory approval, with an expected completion in Q1 2020. OMI is the only electrodeposited copper foil manufacturing facility in North America and services electronics, energy, and industrial markets. OMI has 77 employees. The companies are committed to a smooth transition for its employees and customers.
"The sale of OMI is a key step in optimizing Mitsui Mining and Smelting’s overall product and manufacturing portfolio," said Masayuki Misawa, Executive Officer and Senior General Manager of the Copper Foil Division at Mitsui Mining & Smelting. "This transaction allows the North American business to unlock its potential and better serve its customers under Nippon Denkai’s ownership. We are grateful for the many years of partnership with the teams in both Camden, SC and Hoosick Falls, NY and wish them a successful future.”
“The OMI team will be a welcome addition to Nippon Denkai," said Hidemasa Nakajima, President and CEO of Nippon Denkai, Ltd. "They have built a solid foundation of business in North America that we intend to build upon. The acquisition of OMI provides a path for us to diversify into alternative market segments and add presence into strategic geographical locations.”
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.
How Good Design Enables Sustainable PCBs
08/21/2025 | Gerry Partida, Summit InterconnectSustainability has become a key focus for PCB companies seeking to reduce waste, conserve energy, and optimize resources. While many discussions on sustainability center around materials or energy-efficient processes, PCB design is an often overlooked factor that lies at the heart of manufacturing. Good design practices, especially those based on established IPC standards, play a central role in enabling sustainable PCB production. By ensuring designs are manufacturable and reliable, engineers can significantly reduce the environmental impact of their products.