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Mitsui Mining & Smelting Co. Ltd. to Sell Copper Foil Division to Nippon Denkai, Ltd.
December 20, 2019 | Oak-MitsuiEstimated reading time: 1 minute
Mitsui Mining & Smelting Co., Ltd. (TYO: 5706), a global leader in engineered materials and copper foil for printed circuit applications, announced that it has entered into a definitive agreement to sell the Company's copper foil manufacturing division, known as Oak Mitsui, Inc. (OMI), with locations in Camden, South Carolina and Hoosick Falls, New York, to Nippon Denkai, Ltd., a leader in copper foil manufacturing for lithium ion batteries.
OMI will be transferred in whole to Nippon Denkai, Ltd. pending regulatory approval, with an expected completion in Q1 2020. OMI is the only electrodeposited copper foil manufacturing facility in North America and services electronics, energy, and industrial markets. OMI has 77 employees. The companies are committed to a smooth transition for its employees and customers.
"The sale of OMI is a key step in optimizing Mitsui Mining and Smelting’s overall product and manufacturing portfolio," said Masayuki Misawa, Executive Officer and Senior General Manager of the Copper Foil Division at Mitsui Mining & Smelting. "This transaction allows the North American business to unlock its potential and better serve its customers under Nippon Denkai’s ownership. We are grateful for the many years of partnership with the teams in both Camden, SC and Hoosick Falls, NY and wish them a successful future.”
“The OMI team will be a welcome addition to Nippon Denkai," said Hidemasa Nakajima, President and CEO of Nippon Denkai, Ltd. "They have built a solid foundation of business in North America that we intend to build upon. The acquisition of OMI provides a path for us to diversify into alternative market segments and add presence into strategic geographical locations.”
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Rachael Temple - AlltematedSuggested Items
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05/13/2026 | I-Connect007As PCB complexity continues to accelerate, fabricators and OEMs are reevaluating long-standing manufacturing processes to meet the demands of AI, HDI, advanced packaging, and next-generation electronics. To address these evolving challenges, I-Connect007 is proud to announce the release of The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication, authored by MacDermid Alpha Solution’s Carmichael Gugliotti.
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.