HARMAN Showcases Life-Saving Potential of Vehicle-to-Pedestrian 5G Technology at CES 2020
January 7, 2020 | Business WireEstimated reading time: 1 minute

HARMAN, a wholly-owned subsidiary of Samsung Electronics Co., Ltd., focused on connected technologies and solutions for automotive, consumer and enterprise markets, today unveiled a new ADAS use case, called Vehicle-to-Pedestrian, which forewarns automobile drivers and pedestrians to potential safety conflicts through the use of Vehicle-to-Everything (V2X) technology. Part of HARMAN’s safety system technologies, Vehicle-to-Pedestrian can be enhanced through 5G-fueled C-V2X networks, which in the coming years will enable all-new in-car experiences.“By introducing 5G technology to the car in a way that is both meaningful and practical, Vehicle to Pedestrian is an exciting innovation that will make our roads safer—and also has the potential to save lives.”
“With well over one million deaths reported every year, road fatalities are a global public safety imperative. Creating technologies that help prevent the injury of drivers, passengers, pedestrians and cyclists is absolutely paramount,” said Dr. Mike Peters, President, HARMAN Connected Car. “By introducing 5G technology to the car in a way that is both meaningful and practical, Vehicle to Pedestrian is an exciting innovation that will make our roads safer—and also has the potential to save lives.”
In the car, Vehicle-to-Pedestrian can work on low latency 5G peer-to-peer signals to identify objects in the vehicle’s path through proximity scanning. Similarly, pedestrians or cyclists with a C-V2X-enabled mobile device will also receive an alert that a vehicle is entering their path. As a result, vehicles, pedestrians and cyclists can be alerted to potential safety conflicts even in situations where advanced cameras can’t see obstructions—such as around corners, or through parked vehicles.
HARMAN’s Vehicle-to-Pedestrian is only one of many safety enhancements enabled by V2X technology, which has defined the peer-to-peer communications protocols that enable situational awareness between vehicles. Now, with the maturation of 5G technologies and networks, C-V2X creates new opportunities for vehicles to communicate with even more of their surroundings - including other vehicles, road infrastructure and control systems, as well as low visibility road users like pedestrians and cyclists.
To learn how HARMAN’s V2P technologies can help make roadways safer for everyone, and discover how HARMAN ExP delivers experiences per mile, visit the HARMAN Showcase at CES or visit car.harman.com.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.