HARMAN Showcases Life-Saving Potential of Vehicle-to-Pedestrian 5G Technology at CES 2020
January 7, 2020 | Business WireEstimated reading time: 1 minute
HARMAN, a wholly-owned subsidiary of Samsung Electronics Co., Ltd., focused on connected technologies and solutions for automotive, consumer and enterprise markets, today unveiled a new ADAS use case, called Vehicle-to-Pedestrian, which forewarns automobile drivers and pedestrians to potential safety conflicts through the use of Vehicle-to-Everything (V2X) technology. Part of HARMAN’s safety system technologies, Vehicle-to-Pedestrian can be enhanced through 5G-fueled C-V2X networks, which in the coming years will enable all-new in-car experiences.“By introducing 5G technology to the car in a way that is both meaningful and practical, Vehicle to Pedestrian is an exciting innovation that will make our roads safer—and also has the potential to save lives.”
“With well over one million deaths reported every year, road fatalities are a global public safety imperative. Creating technologies that help prevent the injury of drivers, passengers, pedestrians and cyclists is absolutely paramount,” said Dr. Mike Peters, President, HARMAN Connected Car. “By introducing 5G technology to the car in a way that is both meaningful and practical, Vehicle to Pedestrian is an exciting innovation that will make our roads safer—and also has the potential to save lives.”
In the car, Vehicle-to-Pedestrian can work on low latency 5G peer-to-peer signals to identify objects in the vehicle’s path through proximity scanning. Similarly, pedestrians or cyclists with a C-V2X-enabled mobile device will also receive an alert that a vehicle is entering their path. As a result, vehicles, pedestrians and cyclists can be alerted to potential safety conflicts even in situations where advanced cameras can’t see obstructions—such as around corners, or through parked vehicles.
HARMAN’s Vehicle-to-Pedestrian is only one of many safety enhancements enabled by V2X technology, which has defined the peer-to-peer communications protocols that enable situational awareness between vehicles. Now, with the maturation of 5G technologies and networks, C-V2X creates new opportunities for vehicles to communicate with even more of their surroundings - including other vehicles, road infrastructure and control systems, as well as low visibility road users like pedestrians and cyclists.
To learn how HARMAN’s V2P technologies can help make roadways safer for everyone, and discover how HARMAN ExP delivers experiences per mile, visit the HARMAN Showcase at CES or visit car.harman.com.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Nordson Electronics Solutions to Demonstrate Automated Fluid Dispensing and Selective Soldering Systems at productronica 2025
11/06/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for printed circuit board assembly and advanced packaging at Productronica 2025, joining their longstanding distribution partners Amtest Group, stand A2.532, and smartTec Gmbh, stand A2.527, as well as in the Future Packaging Hybrid Live Lab, stand B2.261.
GlobalFoundries, Silicon Labs Expand Partnership to Accelerate Wireless Connectivity Solutions and Strengthen U.S. Chip Manufacturing
11/05/2025 | GlobalFoundriesGlobalFoundries (GF), one of the world’s leading semiconductor manufacturers, and Silicon Labs, the leading innovator in low-power wireless, announced the expansion of their strategic partnership to advance the development of next-generation, energy-efficient wireless technologies and scale U.S.-based semiconductor manufacturing.
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
On the Line with… Ultra HDI, Episode 8: “Materials, Up and Coming Capabilities,” Now Available
11/05/2025 | I-Connect007I-Connect007 is excited to announce the release of the eighth episode of its 12-part podcast series, On the Line with… American Standard Circuits: Ultra HDI. In this episode, “Materials, Up and Coming Capabilities,” host Nolan Johnson sits down with resident expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to discuss how material selection influences the Ultra HDI (UHDI) manufacturing process.
High Density Packaging User Group Announces ASKPCB Membership
11/03/2025 | HDP User GroupHigh Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.