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Nordson Electronics Solutions to Demonstrate Automated Fluid Dispensing and Selective Soldering Systems at productronica 2025

11/06/2025 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for printed circuit board assembly and advanced packaging at Productronica 2025, joining their longstanding distribution partners Amtest Group, stand A2.532, and smartTec Gmbh, stand A2.527, as well as in the Future Packaging Hybrid Live Lab, stand B2.261.

Aismalibar, Technosystem Showcase Next-Generation PCB Solutions at productronica 2025

11/05/2025 | Aismalibar
BENMAYOR S.A., parent company of Aismalibar and Technosystem, will present its latest innovations in thermal management materials and PCB automation systems at Productronica 2025, the world’s leading trade fair for electronics development and production.

Learning With Leo: UHDI—The Next Leap in PCB Manufacturing

11/05/2025 | Leo Lambert -- Column: Learning With Leo
High density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.

EIPC Technical Snapshot: Sustainability in Electronics Manufacturing

11/06/2025 | Pete Starkey, I-Connect007
EIPC selected the highly topical issue of sustainability in electronics manufacturing for the 24th Technical Snapshot webinar on Oct. 29, with guest speakers Satoshi Konagai of Elephantech and Liisa Hakola of the VTT Technical Research Centre of Finland. The program was moderated by Kirsten Smit-Westenberg, executive director of EIPC, who also introduced each speaker.

UHDI Fundamentals: UHDI Technology and Automated Inspection

11/03/2025 | Anaya Vardya, American Standard Circuits
Following up on the last article on integrating ultra high density interconnect (UHDI) PCB technologies and Quality 5.0, here we will do a deeper dive into the automated inspection component. UHDI applications demand extreme precision, with line/space dimensions below 25 µm and microvias below 30 µm. Automated inspection systems are essential to achieving the defect-free fabrication required at these scales, and legacy automated inspection systems are becoming obsolete and ineffective.
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