-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Experience Mycronic’s Comprehensive Range of Advanced Electronics Assembly Technologies at IPC APEX EXPO
January 15, 2020 | Mycronic ABEstimated reading time: 3 minutes
Through data-driven production there are more ways than ever to gain new insights and better control the electronics production. Mycronic’s vision is to enable a zero-defect assembly line with the highest utilization for any product mix.
Mycronic is leveraging its end-to-end expertise, software and solutions to unleash new levels in quality, flexibility and productivity throughout the factory. At IPC APEX EXPO in San Diego 4-6 February, Mycronic will show a wide array of state-of-the-art assembly technologies that will help improve quality, flexibility and productivity in electronics manufacturing, including new advances in machine-to-machine communication, machine learning, full SMT line capabilities and automated material handling systems.
“We’re moving quickly to a production that’s more predictive, more adaptive to dynamic changes and far more data-driven. It’s our commitment to provide our customers innovative production solutions, together with deeper, more useful insights into their processes,” says Thomas Stetter, Sr VP, Assembly Solutions.
Standardization and integration to further enable the smart factory
The need for customized horizontal and vertical integration is certain to grow in the future, as manufacturers experience ever-increasing demands for transparency. Industry communication standards such as Hermes, CFX and IPC-2581 (Digital Product Model Exchange) will play an important role in this development. Mycronic is supporting and actively participating in the development of these standards.
Full SMT line solution with expanded capabilities
Learn how our latest fully integrated production solution MYPro Line helps you eliminate defects and increase utilization for the most demanding build schedules. At APEX we will demonstrate a number of new hardware, software and automation capabilities.
- Award-winning AI² solution for a zero-defect production
Discover how our fully integrated 3D SPI and jet printing solution automatically identifies and corrects missing or damaged solder paste print to help you maintain the highest throughput speeds with simpler stencil designs and zero defects.
- Unleash new levels in productivity with MY700 Jet Printer and Dispenser
Mycronic's software-driven MY700 solution offers solder paste jet printing and high-speed jet dispensing of adhesives with unrivalled flexibility while reducing production costs and manual rework. The MY700 allows you to produce complex boards with a speed of more than one million dots per hour.
- Award-winning SIGMA Link
The SIGMA Link software, a real-time web-based interface that correlates data between solder paste inspection and automated optical inspection, now features more intuitive process controls to further improve inspection efficiency and first pass yield.
- Versatile pick-and-place solution
The industry’s most versatile pick-and-place solution is now faster, smaller and smarter than ever. Learn how the new MY300HX and MY300EX machines make it possible to build lines that maintain the highest utilization levels at speeds up to 100,000 components per hour.
- Stops defects at their source with the new K-Series 3D AOI
Find out how our advanced 3D AOI system helps maximize first pass yield with a scalable solution for both pre-reflow and post-reflow inspection. Also, the new AOI software platform embeds machine learning based technology resulting in faster programming.
- Smarter material flow
Stock accuracy, traceability, and delivery performance are key aspects of a material handling system. Increased automation is required, and in many cases is already ongoing. The Mycronic SMD Tower provides more intelligent and automatic access to component reels and trays.
Experience advanced conformal coating and dispensing robots
Mycronic’s MYSmart series is rapidly evolving, and a number of new hardware and software solutions will be on display at APEX. The MYC50 conformal coating system, with its new intuitive user interface, precision spray valve and flow monitoring system, promises to deliver even higher levels of precision, repeatability and yield. Also, explore a range of robots for all dispensing needs – from tabletop to inline solutions. The new MYD55 will demonstrated true 5-axis dispensing and the expansive valve offering enables you to dispense any fluid to meet your production requirements.
Learn how safe plasma cleaning robots increase yields
The new MYS atmospheric plasma system with safe plasma technology, protects your bottom line and is safe to the touch. These robots safely ensure cleaner operations and up to 50 times faster cleaning speeds, higher yields and improved traceability compared to traditional vacuum plasma systems. From semiconductor packaging to sensitive plastics the MYS can plasma clean any sensitive surface.
“Visit us at APEX and learn more how our latest developments tackle the rising complexity in the electronics assembly, with the aim to enhance our customers’ control over the data, processes and material flows that matter most to their success.” says Brian Duffey, President of Mycronic Inc.
The full range of new production line solutions will be on display at the Mycronic exhibition booth #1336 at IPC APEX EXPO 2020, February 4-6 at the San Diego Convention Center.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.