-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueMoving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young Celebrates the Laritech Grand Opening and Expansion
January 21, 2020 | Koh Young TechnologyEstimated reading time: 2 minutes

A Grand Opening ceremony will be held on Thursday, January 23, 2020 to celebrate the opening of a new Laritech facility in Moorpark, California. “As a long-standing Koh Young partner, we could not be prouder of their growth and trajectory,” said Allen Phung, Regional Sales Manager for Koh Young America. “At the event, visitors will be able to see why Koh Young is proud of the accomplishments reached by Laritech. We look forward to continuing this relationship and supporting their growth.”
From humble beginnings in Bill Larrick’s garage during the late 90s as a prototype manufacturer of printed circuit board assemblies, his vision has propelled them into the larger campus with multiple production lines. Today, Laritech supports customers across almost every conceivable market with everything from product concept and design to full production. With AS9100 Revision D, ITAR certification, Apple MFi support, and many other manufacturing process quality certifications, customers can rest assured the product will receive the utmost attention. “Not only do we appreciate the support from Koh Young at our Grand Opening, but we realize the importance their machines play in helping us deliver the highest quality products to our customers.”
Laritech, Inc. is an engineering driven business thriving on design of embedded controls, firmware, and software. Time has proven that Laritech has the capability and experience to help in product development, prototype, and production, which includes several Koh Young solder paste inspection (SPI) and automated optical inspection (AOI) systems. Since 2001, Laritech Engineering has completed upwards of 400 designs and is available to engage at any point in the design cycle.
The company focus ensures customers have a complete support and will never be left wondering where to turn. “Whether in need of new product introduction, redesign, surface mount conversion, or looking for an ally to take over a project someone failed to complete, we can be your partner every step of the way,” said Larrick. “Not only to we appreciate the support from Koh Young at our Grand Opening, but we realize the importance their machines play in helping us deliver the highest quality products to our customers.”
If you cannot attend the grand opening, please visit Laritech.com to learn more about their operations. To learn more about Koh Young Technology and its best-in-class inspection solutions at www.kohyoung.com.
About Koh Young
Koh Young, the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, Penang, China, Brazil, Argentina, Canada, Mexico, and the United States. These local facilities ensure it maintains a close relationship with its growing customer base and provides them with access to a global network of inspection and measurement experts.
Suggested Items
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.