-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young Celebrates the Laritech Grand Opening and Expansion
January 21, 2020 | Koh Young TechnologyEstimated reading time: 2 minutes

A Grand Opening ceremony will be held on Thursday, January 23, 2020 to celebrate the opening of a new Laritech facility in Moorpark, California. “As a long-standing Koh Young partner, we could not be prouder of their growth and trajectory,” said Allen Phung, Regional Sales Manager for Koh Young America. “At the event, visitors will be able to see why Koh Young is proud of the accomplishments reached by Laritech. We look forward to continuing this relationship and supporting their growth.”
From humble beginnings in Bill Larrick’s garage during the late 90s as a prototype manufacturer of printed circuit board assemblies, his vision has propelled them into the larger campus with multiple production lines. Today, Laritech supports customers across almost every conceivable market with everything from product concept and design to full production. With AS9100 Revision D, ITAR certification, Apple MFi support, and many other manufacturing process quality certifications, customers can rest assured the product will receive the utmost attention. “Not only do we appreciate the support from Koh Young at our Grand Opening, but we realize the importance their machines play in helping us deliver the highest quality products to our customers.”
Laritech, Inc. is an engineering driven business thriving on design of embedded controls, firmware, and software. Time has proven that Laritech has the capability and experience to help in product development, prototype, and production, which includes several Koh Young solder paste inspection (SPI) and automated optical inspection (AOI) systems. Since 2001, Laritech Engineering has completed upwards of 400 designs and is available to engage at any point in the design cycle.
The company focus ensures customers have a complete support and will never be left wondering where to turn. “Whether in need of new product introduction, redesign, surface mount conversion, or looking for an ally to take over a project someone failed to complete, we can be your partner every step of the way,” said Larrick. “Not only to we appreciate the support from Koh Young at our Grand Opening, but we realize the importance their machines play in helping us deliver the highest quality products to our customers.”
If you cannot attend the grand opening, please visit Laritech.com to learn more about their operations. To learn more about Koh Young Technology and its best-in-class inspection solutions at www.kohyoung.com.
About Koh Young
Koh Young, the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, Penang, China, Brazil, Argentina, Canada, Mexico, and the United States. These local facilities ensure it maintains a close relationship with its growing customer base and provides them with access to a global network of inspection and measurement experts.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.