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Advanced Electronics Packaging Digest

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Rehm Thermal Systems Receives 2026 Mexico Technology Award for RDS UV LED

10/22/2026 | Rehm Thermal Systems
Rehm Thermal Systems has been honored with a 2026 Mexico Technology Award for its innovative RDS UV LED curing system. The award was presented on October 7 in conjunction with SMTA Guadalajara.

RTX’s Collins Aerospace Upgrades Radio Altimeters to Meet FAA Standards

10/21/2026 | PRNewswire
Collins Aerospace, an RTX business, announced upgrades for its family of radio altimeters, providing business aviation operators a clear path to meet new Federal Aviation Administration (FAA) operational standards.

MKS Introduces ESI Digital Factory Suite for Flex PCB Manufacturing

10/20/2026 | MKS Inc.
Digital Factory Suite centralizes critical laser-system data to improve visibility, accelerate response, and strengthen factory performance

BAE Systems Wins Space Force Contract for Resilient Satellite Communications Terminals

10/19/2026 | BAE Systems
BAE Systems has been awarded a contract from the U.S. Space Force Space Systems Command (SSC) to design and demonstrate ultra-compact radio-frequency (RF) terminals for a space-based data layer.

Enabling the Interconnect Technologies That Transform Our World: MKS’ Strategic Role in Powering the Future of AI and HPC

10/20/2026 | John T.C. Lee, with Won Lee, Marc Tricard, and Kuldip Johal
AI is reshaping industries, economies, and daily life at an unprecedented speed. From generative AI and autonomous systems to high-performance computing (HPC) applications in science, defense, and advanced manufacturing, the demand for computational power is accelerating exponentially. But while algorithms capture the spotlight, the true enabler of this transformation lies deeper, in the physical infrastructure that makes AI possible. Performance in the AI era is no longer defined by transistor shrink alone. It is increasingly defined by how efficient systems are integrated, interconnected, cooled, and manufactured at scale.
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