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AIM’s Ales Sedlak and Petr Bettinec Host Technical Training Session in Saint Petersburg, Russia
February 18, 2020 | AIM SolderEstimated reading time: Less than a minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, was pleased to have Ales Sedlak, Technical Support Engineer and Petr Bettinec, European Sales Manager present at a seminar hosted by Avanteh on February 4, 2020 in Saint Petersburg, Russia. Attendees could also live-stream the event if unable to be present.
The presentation, “A Guide to Achieving Lead-Free Electronics Assembly,” detailed the material and equipment requirements for successful transition to lead-free. With the adoption of RoHS2/ReCast in 2019, all but the most sensitive electronic assembly applications must use lead-free solder alloys. While the subject is well understood, those unfamiliar with lead-free PCB assembly will need a supplier with the experience and tools to expedite a successful lead-free alloy implementation program.
AIM’s specialists reviewed the company’s suite of RoHS compatible products, their proper use and implementation, including low-temperature, high-reliability and cost-saving materials in addition to commonly used lead-free materials.
AIM’s global reach goes beyond a robust supply chain. Technical support includes educating our user base and sales channels to the proper implementation of AIM products in order to maximize performance, reduce overhead and speed production.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.