Dan’s Biz Bookshelf: ‘Dream First, Details Later
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
Facing the Future: Time for Real Talk, Early and Often, Between Design and Fabrication
Atotech to present at the iMAPS Device Packaging Conference in Fountain Hills, Arizona USA
February 24, 2020 | AtotechEstimated reading time: Less than a minute
Atotech, a leading global provider of electroplating and surface-finishing chemicals and equipment for PCB, semiconductor advanced packaging and dual damascene applications, is pleased to announce its participation in the iMAPS Device Packaging Conference held at the WekoPa Resort in Fountain Hills, Arizona, on March 3?5, 2020.
Atotech expert Dr. Britta Schafsteller will present at the Advanced Packaging & Emerging Materials for Automotive, 5G & Next Gen Applications track in room 102-103 on Thursday, March 5, from 10:45?11:15 a.m. Her presentation is entitled, “Autocatalytic tin—how to overcome process limitations to introduce a new solution for thick tin plating.” In her presentation, Dr. Schafsteller will show exemplary tin deposits, which were plated with an autocatalytic electrolyte comparing their layer properties to those of other conventional final finishes like immersion tin or electroless nickel/immersion gold (ENIG).
Share on:
Suggested Items
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Uyemura Expands Engineering Team in Great Lakes Region
05/30/2025 | UyemuraAndrew Jin has joined Uyemura’s Engineering Team as Technical Service Engineer for the Midwest. Jin was formerly with Sensient Technologies, Flavors and Extracts Division, where his focus was CO2 emissions and water quality; he also did capital project work with production equipment.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Real Time with... IPC APEX EXPO 2025: Uyemura—Inside the Specialty Chemicals Market
04/03/2025 | Real Time with...IPC APEX EXPORich Depoto discusses Uyemura's focus on specialty chemicals and market trends, particularly the shift towards HDI and UHDI products. Rich highlights innovations in surface adhesion and micro etches for copper, essential for high-speed transmission.
Uyemura Announces Six Sigma Graduates
04/02/2025 | UyemuraDr. Patrick Valentine, Technical & Lean Six Sigma Manager and Six Sigma Master Black Belt, announces the completion of Lean Six Sigma Black Belt training by 4 members of Uyemura’s professional staff.