Flexible Thinking: Rules of Thumb: A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
NextFlex Honored with FLEXI Award for its FlexPro Professional Development Education Program
February 28, 2020 | NextFlexEstimated reading time: 1 minute
NextFlex®, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, was awarded the FLEXI Technology Leadership in Education Award for its FlexPro program yesterday at the SEMI Flex Conference in San Jose, California.
Launched in 2019, FlexPro is a professional training program designed to educate participants in FHE technologies and manufacturing processes. The immersive program targets working professionals in a corporate setting and provides hands-on lab time and design sprints so attendees can work in teams to consider applicability to their own product lines. To date, over 100 engineers, researchers and product developers have completed the FlexPro program.
“We are honored to receive this award recognizing FlexPro’s strides in making FHE technology more tangible to professionals within the advanced manufacturing ecosystem,” said Emily McGrath, director of Workforce Development at NextFlex. “The strategic advancements NextFlex is making with FlexPro are supporting FHE’s transition into commercialization, while also disseminating critical awareness and promoting more visibility around this technology. We are helping today’s working professional technologists, manufacturing leaders and design engineers discover the unique advantages that FHE provides—thin, lightweight and conformable form factors, quick to market, and low cost.”
The four-part course includes an introduction to:
- The variety of applications for FHE, including drivers and benefits, and manufacturing and technology program examples
- The engineering aspects of FHE, such as system design, efficiency improvements, integration and operations, and process flow
- Manufacturing and fabrication materials of FHE, including their process, tools, hands-on applications and product identifications
- A team-based design challenge focused on designing FHE in to new product introductions
For more information about the FlexPro program, please visit https://www.nextflex.us/learning-programs/flex-pro/.
Share on:
Suggested Items
Intervala Hosts Employee Car and Motorcycle Show, Benefit Nonprofits
08/27/2024 | IntervalaIntervala hosted an employee car and motorcycle show, aptly named the Vala-Cruise and it was a roaring success! Employees had the chance to show off their prized wheels, and it was incredible to see the variety and passion on display.
KIC Honored with IPC Recognition for 25 Years of Membership and Contributions to Electronics Manufacturing Industry
06/24/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is proud to announce that it has been recognized by IPC for 25 years of membership and significant contributions to electronics manufacturing.
Boeing Starliner Spacecraft Completes Successful Crewed Docking with International Space Station
06/07/2024 | BoeingNASA astronauts Barry "Butch" Wilmore and Sunita "Suni" Williams successfully docked Boeing's Starliner spacecraft to the International Space Station (ISS), about 26 hours after launching from Cape Canaveral Space Force Station.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.