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Follow the Story: Building the Hardware Behind AI

09/24/2026 | Michelle Te, I-Connect007
When TTM opened its new UHDI facility in New York earlier this year, it wasn't simply adding another PCB factory. As the largest circuit board builder in the United States, TTM was investing in technologies that bring PCB fabrication closer to the complex world of semiconductor packaging. The advent of AI helps explain why that matters. The enormous compute power required by AI is pushing chip performance to new levels, but those chips don't operate in isolation.

Valens Semiconductor, onsemi Collaborate on Cost-Optimized MIPI A-PHY Sensor

09/23/2026 | Valens Semiconductor
Valens Semiconductor, a leading provider of high-performance connectivity chipsets, announced a collaboration with onsemi on a cost-optimized integrated sensor for high-volume 3-megapixel automotive camera applications.

Curtiss-Wright Announces Leadership Transition

09/22/2026 | BUSINESS WIRE
Curtiss-Wright Corporation announced that its Board of Directors has elected Kevin M. Rayment, Executive Vice President and Chief Operating Officer, to succeed Lynn M. Bamford as Chief Executive Officer, effective January 1, 2027.

AT&S, Marvell Expand Collaboration for Next-Gen AI Infrastructure

09/22/2026 | AT&S
AT&S announced an expanded collaboration with Silicon Valley company Marvell Technology, a leading provider of data infrastructure semiconductor solutions, to increase advanced IC substrate capacity for next-generation AI and cloud infrastructure.

BAE Systems Receives $16M to Qualify RH45® for Space Missions

09/17/2026 | PRNewswire
BAE Systems has received $16 million in Defense Production Act Title III funding via the Department of War's (DOW) Warfighting Investments, Resourcing, and Execution directorate to demonstrate and qualify its radiation-hardened 45 nanometer (nm) technology.
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