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A Case Study in Conquering High Aspect Ratio Features

07/06/2026 | Richard Nichols, GreenSource Engineering
As demand for high-performance electronics is further driven by advances in AI and machine learning, the importance of high aspect ratio (HAR) through-holes in PCBs and IC substrates has become increasingly apparent. These vias play a vital role in enabling vertical interconnections in complex circuit architectures, especially within HDI structures, where maximizing space and enhancing electrical performance are crucial.

Delta Thailand Advances Sustainable Growth at Asia Sustainable Energy Week 2026

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GÖPEL Electronic Launches MagicCAR Compact Plus Desktop Test Platform for Automotive ECUs

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Technica USA Receives Recognition at PCBAA Annual Meeting

06/24/2026 | Technica USA
chnica USA joined fellow members of the Printed Circuit Board Association of America (PCBAA) in Washington, D.C., for the Association’s Annual Meeting and advocacy events on Capitol Hill.

Technica USA Returns to Capitol Hill to Advocate for Domestic PCB Manufacturing

06/22/2026 | Technica USA
Technica USA joined fellow members of the Printed Circuit Board Association of America (PCBAA) in Washington, D.C., for the Association’s Annual Meeting and advocacy events on Capitol Hill.