Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

The Marketing Minute: Your Metrics Aren’t Telling the Full Story

04/08/2026 | Brittany Martin -- Column: The Marketing Minute
In digital marketing, we tend to rely on the same set of metrics: Average read time. Bounce rate. Session data. For years, these metrics have been the default for gauging marketing success, so it makes sense to rely on them. But in today’s privacy-first B2B environment, they’re becoming less reliable and often misleading. You’re missing part of the picture.

Is AI in Design the Magic Tonic for All That Ails Us?

03/20/2026 | David Wiens, Siemens
In electronic systems design, engineering teams are pressured by management to adopt AI wherever possible to reduce design cycle time and cost. Engineers look at AI with a wary eye: Will it consistently return accurate results? Will it take longer to set up, train, run, and verify than doing it manually? Will it replace me? Yes, there is a transition with AI, but it’s no different than any other form of automation. It must be extensively

Zhen Ding Achieves Record Revenue in 2025 with Both GM and OPM Expanding

03/16/2026 | Zhen Ding
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, held an investor conference and announced its consolidated financial results for the full year of 2025.

IC Substrates vs. UHDI: The Future of Interconnect

03/15/2026 | Marcy LaRont, I-Connect007
Advanced packaging is driving feature sizes below 50 microns, forcing IC substrates and UHDI PCBs into overlapping territory. Following his presentation at the Pan-European Design Conference (PEDC) in January, Jan Pedersen, director of technology at NCAB Group, spoke with us about how heterogeneous integration, evolving HDI roadmaps, and supply chain pressures are shaping the next phase of advanced packaging.

Ventec Expands Manufacturing Footprint with New Thailand Facility Supporting “China + Taiwan Plus One” Supply Chains

03/12/2026 | Ventec International Group
Ventec International Group today provided an update on the progress of its new manufacturing facility in Thailand, which is scheduled to come on stream in Q2 2026, marking an important step in the company’s strategy to diversify global production and support customers seeking China & Taiwan plus one supply chain resilience.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in