Lockheed Martin's PrSM Demonstrates Pinpoint Accuracy in Second U.S. Army Flight Test
March 11, 2020 | Lockheed MartinEstimated reading time: 1 minute

Lockheed Martin successfully tested its next-generation long-range missile designed for the Army's Precision Strike Missile (PrSM) program at White Sands Missile Range, NM. All objectives were achieved in a flawless second performance following the missile's inaugural flight last December.
"Today's flight test further demonstrated the reliability, precision and critical capabilities Lockheed Martin is building into the PrSM," said Gaylia Campbell, vice president of Precision Fires and Combat Maneuver Systems at Lockheed Martin Missiles and Fire Control. "The missile performed exactly as expected and successfully engaged the target with pinpoint accuracy."
PrSM was fired from Lockheed Martin's High Mobility Artillery Rocket System (HIMARS™) launcher and flew a nominal trajectory approximately 180 kilometers to the target area, culminating in a highly accurate and lethal warhead event.
Test objectives included confirming the missile's flight trajectory, range and accuracy from launch to warhead event, as well as warhead lethality, HIMARS launcher integration and overall missile performance.
"This second consecutive successful flight test of Lockheed Martin's PrSM validates our missile technology and confidence that Lockheed Martin is uniquely positioned to deliver this important, cost-effective capability to meet our U.S. Army customer's priorities," Campbell said.
The next-generation precision-strike, surface-to-surface weapon system will deliver enhanced capabilities for attacking, neutralizing, suppressing and destroying targets at depth on the battlefield and give field artillery units a new long-range capability while supporting brigade, division, corps, Army, theater, Joint and Coalition forces.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Designers Notebook: Basic PCB Planning Criteria—Establishing Design Constraints
07/22/2025 | Vern Solberg -- Column: Designer's NotebookPrinted circuit board development flows more smoothly when all critical issues are predefined and understood from the start. As a basic planning strategy, the designer must first consider the product performance criteria, then determine the specific industry standards or specifications that the product must meet. Planning also includes a review of all significant issues that may affect the product’s manufacture, performance, reliability, overall quality, and safety.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
STMicroelectronics, Metalenz Sign a New License Agreement to Accelerate Metasurface Optics Adoption
07/14/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and Metalenz, the pioneer of metasurface optics, announced a new license agreement.
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
Global PCB Connections: Embedded Components—The Future of High-performance PCB Design
06/19/2025 | Jerome Larez -- Column: Global PCB ConnectionsA promising advancement in this space is the integration of embedded components directly within the PCB substrate. Embedded components—such as resistors, capacitors, and even semiconductors—can be placed within the internal layers of the PCB rather than mounted on the surface. This enables designers to maximize available real estate and improve performance, reliability, and manufacturability.