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Advanced Electronics Packaging Digest

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Arda Emerges from Stealth to Speed Up American Manufacturing

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Siemens, NVIDIA Expand Agentic AI Collaboration for 3D IC Power and Thermal Design

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Cadence InnoStack AI Agent Supports Socionext’s 3nm SoC Design

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From IPC Standards to Practical DFM

10/21/2026 | Marcy LaRont, I-Connect007
DFM seems like common sense: If we know the rules a PCB must meet, why not check the design against them before it ever reaches the factory? In practice, of course, it’s not quite that simple. I caught up with Susan Kayesar, product manager at Siemens and longtime contributor to Global Electronics Association standards activities, to talk about an ongoing effort between Siemens and the Association to translate IPC requirements into practical, software-based DFM checks. Susan explains where standards lend themselves to automation, where the gray areas begin, and why checking for IPC compliance is an important starting point, but not a substitute for understanding the capabilities and limitations of the fabricator who will actually build the board.

I-Connect007 Releases New Podcast Episode Exploring the Role of Flexible Circuitry in Consumer Electronics

10/21/2026 | I-Connect007
I-Connect007 is pleased to announce the release of the fourth episode of On the Line With... Qnity: Engineering What’s Next, a six-part podcast series, featuring Bruce Lee, business development and strategy leader, AFT, ICS. In this episode, I-Connect007’s Marcy LaRont explores how advances in flexible circuitry and materials are helping manufacturers meet the growing demands of today's consumer electronics market.
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