Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Introducing 'The Fox Pack' State-of-the-art Expandable Placement and Dispensing from Essemtec
April 22, 2020 | EssemtecEstimated reading time: 1 minute
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, announces that its FOX2 smart-sized modular pick-and-place technology is expandable in any direction. The new FOX2 combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine.
FOX2 has a machine footprint of just under 11 sq. ft and can accept PCB sizes up to 16" x 12". Components with sizes from 01005 up to 3.15 x 3.15"can be placed. The machine achieves 10,800 cph (IPC9850) at 50 µm (3 sigma) with a two-nozzle head.
The two head version is the best seller based on the original award-winning platform, which is the ?rst machine in its class with linear motors and a mineral cast frame, providing excellent speed, stability, accuracy, and making it perfectly suited for use in very high-mix/small-medium production environments. It has proven to be an excellent system for NPI and prototyping as well. When solder paste dispensing is added to the system the need for screen printing and screens can be reduced or eliminated allowing for board design changes and modifications to be accomplished in real time.
The system is flexible and expandable, plus it can be configured with up to 180 feeders in a truly compact space saving platform.
Essemtec’s FOX2 can be fitted with a Jet valve for SMD glue or solder paste for hassle-free manufacturing of 2.5D assemblies or lower cost micro screw valve. Fox2 also features the company’s award-winning ePlace software which is easy to use and intuitive and featured on all Essemtec platforms.
Share on:
Suggested Items
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.