Standard of Excellence: Anticipating Customer Needs Early and Often
The Knowledge Base: At the Forefront of Electronics Manufacturing
Global Citizenship: Training the Next Generation of Talent
Introducing 'The Fox Pack' State-of-the-art Expandable Placement and Dispensing from Essemtec
April 22, 2020 | EssemtecEstimated reading time: 1 minute
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, announces that its FOX2 smart-sized modular pick-and-place technology is expandable in any direction. The new FOX2 combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine.
FOX2 has a machine footprint of just under 11 sq. ft and can accept PCB sizes up to 16" x 12". Components with sizes from 01005 up to 3.15 x 3.15"can be placed. The machine achieves 10,800 cph (IPC9850) at 50 µm (3 sigma) with a two-nozzle head.
The two head version is the best seller based on the original award-winning platform, which is the ?rst machine in its class with linear motors and a mineral cast frame, providing excellent speed, stability, accuracy, and making it perfectly suited for use in very high-mix/small-medium production environments. It has proven to be an excellent system for NPI and prototyping as well. When solder paste dispensing is added to the system the need for screen printing and screens can be reduced or eliminated allowing for board design changes and modifications to be accomplished in real time.
The system is flexible and expandable, plus it can be configured with up to 180 feeders in a truly compact space saving platform.
Essemtec’s FOX2 can be fitted with a Jet valve for SMD glue or solder paste for hassle-free manufacturing of 2.5D assemblies or lower cost micro screw valve. Fox2 also features the company’s award-winning ePlace software which is easy to use and intuitive and featured on all Essemtec platforms.
Share on:
Suggested Items
KYZEN to Highlight Stencil and Cleaning Solutions at SMTA Monterrey
03/27/2025 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, April 10 at the Cintermex Convention Center in Monterrey, Nuevo León. KYZEN cleaning experts will be on-site highlighting stencil cleaning chemistries KYZEN E5631J and CYBERSOLV C8882.
Indium to Showcase Proven EV Products and High-Reliability Alloys at Productronica China
03/26/2025 | Indium CorporationAs a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 26-28, in Shanghai, China.
SolderKing Enhances Brainboxes' Electronics Manufacturing with Expert Support and Advanced Materials
03/26/2025 | SolderKingIn modern electronics manufacturing, success relies on more than high-quality soldering materials. Technical knowledge and process expertise are just as crucial for achieving consistent results. SolderKing, a leading UK manufacturer, provides both, combining advanced consumables with specialist support to help manufacturers optimise their soldering processes.
AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Monterrey Expo & Tech Forum
03/20/2025 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Monterrey Expo & Tech Forum taking place on April 10 at Cintermex in Monterrey, Nuevo Leon, Mexico.
Hentec Industries/RPS Automation to Showcase Valence 2508 at IPC Expo 2025
03/17/2025 | Hentec Industries/RPS AutomationThe Valence 2508 Selective Soldering System is engineered for high-mix, high-volume, advanced PCB production. It supports boards ranging from 25 x 25 mm to 559 x 559 mm (1 x 1 in. to 22 x 22 in.), with a maximum processing area of 508 x 508 mm (20 x 20 in.).