Eyelit’s FactoryConnect Selected by a Semiconductor Technology Leader to Optimize Factory Integration at Three Sites
April 30, 2020 | Business WireEstimated reading time: 1 minute
Eyelit Inc. is a manufacturing software provider for visibility, control, and coordination of manufacturing operations. Today Eyelit announced that a global leader in semiconductor manufacturing is deploying Eyelit’s FactoryConnect™ at multiple high-volume wafer fabs.
FactoryConnect is a configurable integration hub used to centralize connections, and coordinate information between various applications throughout a factory. FactoryConnect provides support for multiple protocols while managing real-time events and exceptions between independent systems. Within this deployment, FactoryConnect is used for exchanging information between various factory applications including an operator GUI, PROMIS MES, tool automation, reticle management, electronic logbooks, SPC, and OCAPS. Through centralized configuration, FactoryConnect efficiently defines and adapts operational scenarios between systems, rather than using point-to-point, hard-coded programming.
FactoryConnect offers faster, easier integration of factory devices including systems enabling smart factory. It provides flexibility to visually create reusable business logic, with the ability to quickly change how systems interact without worrying about downtime.
“Previously we provided OperatorStation, SupervisorStation (GUI’s) and Workflow Manager (Harmon*Eyes) to help companies automate transactions between their legacy PROMIS™ MES and other systems”, stated Dan Estrada, Eyelit’s Vice-President of Sales and Marketing. “Today, FactoryConnect is our next-generation integration hub that empowers companies’ IoT and Industry 4.0 programs. FactoryConnect is MES independent. It can either integrate with or enable the replacement of the following legacy MES systems: Camstar, FactoryWorks, PROMIS and WorkSteam.”
With FactoryConnect, customers can also leverage other Eyelit software modules while keeping their own legacy MES solutions. These modules include: ADS™, Asset Management, EquipmentConnect, QMS, (8D, OCAP, RMA, NCR), RMS (recipe management), and SPC.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.Subscribe now to stay informed, competitive, and connected.
Suggested Items
Hon Hai, Mitsubishi Electric Exploring Automotive Equipment Business in MOU
04/29/2026 | Hon Hai Precision Industry Co., Ltd.Hon Hai Precision Industry Co. Ltd. (Foxconn) and Mitsubishi Electric Corporation have signed a Memorandum of Understanding to explore a strategic alliance through joint operation of the automotive equipment business.
SEMIEXPO Heartland 2026 Highlights Automotive Electronics and Smart Manufacturing Innovation
04/29/2026 | SEMIThe second edition of SEMIEXPO Heartland opens this week, April 29-30 at the Detroit Marriot at the Renaissance Center in Detroit, Michigan, centered around smart manufacturing, automotive electronics, and workforce development.
Ventec Evaluates US Manufacturing Facility to Support North American Growth
04/28/2026 | Ventec International GroupVentec International Group today announced that it is evaluating the potential establishment of a manufacturing facility in the United States to support its growing North American customer base with high-performance laminate and prepreg materials.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
American Made Advocacy: Rebuilding America’s Military Stockpiles Begins With Microelectronics
04/28/2026 | Shane Whiteside -- Column: American Made AdvocacyCurrent world events demonstrate the fragility of long-distance supply chains transiting multiple zones of conflict. The U.S. military is currently drawing down supplies of key munitions and other electronic systems at unprecedented rates.1Every one of those systems is powered by printed circuit boards. The American PCB industry has kept pace with peacetime demand for the defense industry, but will now be called upon to increase production to a wartime footing at rates not seen in decades.