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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

BTU International Launches Aurora Vacuum Reflow Oven for High-Volume Manufacturing

08/26/2026 | BTU International, Inc.
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced the launch of the Aurora Vacuum™ Reflow Oven, a next-generation vacuum reflow platform engineered to deliver exceptional solder quality, maximum throughput, and higher manufacturing yields for advanced electronic assemblies.

IBM Completes Acquisition of HRL Laboratories to Accelerate the Future of Quantum

08/26/2026 | IBM
IBM announced it has completed its acquisition of HRL Laboratories, LLC (HRL), a leading research and development institution whose expertise spans quantum computing, quantum sensing, advanced communications, electronics, manufacturing, and materials science.

MacDermid Alpha Addresses Advanced Packaging Materials Challenges at SEMICON Taiwan 2026

08/26/2026 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions will highlight materials and process technologies designed to address the performance, reliability and manufacturing challenges created by artificial intelligence (AI), high-performance computing (HPC) and increasingly complex advanced packaging architectures at SEMICON Taiwan 2026, September 2–4 at the TaiNEX Nangang Exhibition Center in Taipei.

Micron Opens State-of-the-Art Training Center in Boise to Strengthen America’s Semiconductor Workforce

08/26/2026 | Micron
Micron Technology Inc., the only U.S.-based manufacturer of memory and storage solutions, opened a 60,000-square-foot Micron Training Center (MTC) in Boise, a strategic investment to strengthen the skilled talent pipeline, support advanced semiconductor manufacturing and expand education and apprenticeship pathways in Idaho.

Where Will the Next Generation of Great Engineers Come From?

08/26/2026 | Brian Buyea, Remtec
Most young engineers do not grow up dreaming about careers in ceramic substrates or plating processes. It’s not because these careers are uninteresting. In many cases, young people simply do not know they exist. They are excited about AI, robotics, aerospace, autonomous vehicles, space exploration, renewable energy, electric vehicles, medical technology, and advanced computing. What many students do not yet understand is that virtually every one of those technologies depends upon an incredibly sophisticated electronics manufacturing infrastructure.
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