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Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026

04/23/2026 | Remtec
Remtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).

Lockheed Martin Wins Navy Contract for PAC-3 MSE Aegis Integration

04/23/2026 | Lockheed Martin
The U.S. government announced a contract with Lockheed Martin for the development, integration and testing of PAC-3® Missile Segment Enhancement (MSE) into the Aegis Combat System.

Scanfil Q1 2026: Solid Start with Significant Growth in Turnover and Profit

04/23/2026 | Scanfil
Scanfil opens its landmark 50th anniversary year on a high note, posting a 19.0% rise in turnover to EUR 229.1 million and a 24.1% jump in comparable EBITA in Q1 2026, backed by healthy organic growth and two game-changing acquisitions that have taken the company to an entirely new scale.

OE‑A Publishes 10th Edition of the Roadmap for Flexible and Printed Electronics

04/22/2026 | OE-A
With the publication of the 10th edition of the “OE-A Roadmap for Flexible and Printed Electronics,” the OE-A, an international working group for printed electronics within the VDMA, once again presents the central guidance and reference document for the industry.

Kitron Secures EUR 37 Million Order for Next-Generation Tactical Communication Equipment

04/22/2026 | Kitron
Kitron has secured an order valued at approximately EUR 37 million for the production and supply of advanced radio systems used in tactical mobile platforms.
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