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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Recognizing the Passing of Industry Veteran Brian Keith Fisher
May 13, 2020 | Al FisherEstimated reading time: 2 minutes
The PCB industry recognizes the passing of Brian Keith Fisher of Port Orchard, Washington, on Sunday, May 3, 2020. His network of friends and acquaintances was vast as he had worked in many areas of the industry including as a plater, a laminator, in distribution as a manufacturer’s representative, a copper foil supplier, and ultimately for a copper foil manufacturer. Brian might also be considered one of the fathers of using foil cap lamination, instead of the more common core cap, used in the early stages of multilayer construction. In the early '80s, there were only a few fabricators that were interested in this approach which, has become commonplace today.
Brian’s PCB career began in Palo Alto, California, with a company affiliated with Hewlett Packard. Later on, he moved to Everett, Washington, to join John Fluke Manufacturing. His next stop was Mica Laminates in Culver City, California, working in the technical marketing department supplying copper-clad laminates to the electronics industry. He later returned to Washington state, and in 1979, started American Pacific Marketing to provide Northwest fabricators with many of the consumables used in plating and drilling, progressing from his house to a warehouse in Redmond. In 1997, this business was sold to Electrical Insulation Suppliers, and Brian joined forces with them to coordinate sales of APM’s broad product line. Brian left EIS to begin working at Circuit Foil, providing sales and technical support for their products in the U.S.
Later on, he would leave Circuit Foil to begin a new adventure in the agricultural industry, specifically harvesting, storing, and reselling bee pollen to improve crop yields for farmers for a large part of the West Coast. He performed that duty until mid-2019, at which time he fully retired and pursued his real passion for woodworking from his home with some limited commercial applications.
In the 35 years that Brian was in the industry, competitors would tell you he was a tough guy to get out of an account. He was an innovator and was not afraid to try things even though they had never been done before. He was a leader, a mentor, and a friend to many. He will be missed.
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Rachael Temple - AlltematedSuggested Items
I-Connect007 Releases The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication
05/13/2026 | I-Connect007As PCB complexity continues to accelerate, fabricators and OEMs are reevaluating long-standing manufacturing processes to meet the demands of AI, HDI, advanced packaging, and next-generation electronics. To address these evolving challenges, I-Connect007 is proud to announce the release of The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication, authored by MacDermid Alpha Solution’s Carmichael Gugliotti.
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.