DuPont Publishes 2020 Global Photovoltaic Reliability Report
May 13, 2020 | DuPontEstimated reading time: 2 minutes

DuPont recently released its latest Global Photovoltaic Reliability Report, with results from its highly developed field inspection and analysis program that monitors material degradation and its impact on module performance.
This unique and innovative program features a multi-step inspection protocol conducted by DuPont scientists and engineers in North America, Europe, Asia and the Middle East. A number of variables were analyzed in the course of the inspections including component, material, mounting, time in service and climate.
The 2020 field report was compiled from inspection and analysis of nearly 3 gigawatts (GW) of photovoltaic (PV) installations around the globe, spanning 9 million panels.
Key findings (compared to 2019):
- Total module defects: 30%
- Total backsheet defects: 16%
- The overall outer layer cracking rate of polyvinylidene fluoride (PVDF) backsheets increased by more than three times
Emerging trends in backsheet failures include:
- Rapid increase in cracking in PVDF backsheets
- Cracking of inner layers
- Delamination in double glass modules.
“As we begin a new decade, DuPont continues to work on assessing how panels and materials are aging in the field, often with sobering results,” said Dr. Kaushik Roy Choudhury, senior scientist and global technology leader, DuPont Photovoltaic Solutions. “As materials scientists we apply our skills on diagnosing and analyzing degradation in actual outdoor conditions, of both traditional glass/backsheet panels, as well as newer dual glass bifacial modules. The learnings and insights we collect from the field continue to point to the vital importance of selecting the appropriate Bill of Materials for solar panels, to help protect investments for the long-term.”
The DuPont team has observed nearly a four-fold cumulative increase in PVDF outer-layer cracking defect rates, from 5% to 23% between year four and year nine after installation in China, Europe, India and North America. Deeper backsheet cracks have led to backsheet delamination, exposing the core layer to elements and leading in some instances to inverter tripping and ground faults.
Inner layer cracking has been frequently encountered in fluoroethylene vinyl ether (FEVE) and polyethylene terephthalate (PET) backsheets. This can directly impact power through delayed inverter starts, ground faults and fires.
“Delamination and cracking were observed in multiple double glass module installations,” Choudhury said. “Delamination appears to originate near edges of a module or at individual cells, while cracks likely originate at scratches or chips on glass surfaces and edges or at stress risers introduced by the racking system”.
The comprehensive report is intended to help buyers and investors understand the breadth of component degradation issues and module failures that can occur in the field. The report can be downloaded free of charge at photovoltaics.dupont.com.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Fresh PCB Concepts: Designing for Success at the Rigid-flex Transition Area
08/28/2025 | Team NCAB -- Column: Fresh PCB ConceptsRigid-flex PCBs come in all shapes and sizes. Manufacturers typically use fire-retardant, grade 4 (FR-4) materials in the rigid section and flexible polyimide materials in the flex region. Because of the small size, some rigid-flex PCBs, like those for hearing aid devices, are among the most challenging to manufacture. However, regardless of its size, we should not neglect the transition area between the rigid and flexible material.
Global Sourcing Spotlight: How to Evaluate Supplier Capabilities Worldwide
08/20/2025 | Bob Duke -- Column: Global Sourcing SpotlightIn global sourcing, the difference between a competitive edge and a catastrophic disruption often comes down to how well you vet your suppliers. Sourcing advanced PCBs, precision components, or materials for complex assemblies demands diligence, skepticism, and more than a little time on airplanes. Here’s how to do your due diligence when evaluating international suppliers and why cutting corners can cost you more than money.
Insulectro and Electroninks Sign North American Distribution Agreement
08/12/2025 | InsulectroElectroninks, a leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced a strategic collaboration and distribution partnership with Insulectro, a premier distributor of materials used in printed electronics and advanced interconnect manufacturing.
Happy’s Tech Talk #41: Sustainability and Circularity for Electronics Manufacturing
08/13/2025 | Happy Holden -- Column: Happy’s Tech TalkI attended INEMI’s June 12 online seminar, “Sustainable Electronics Tech Topic Series: PCBs and Sustainability.” Dr. Maarten Cauwe of imec spoke on “Life Cycle Inventory (LCI) Models for Assessing and Improving the Environmental Impact of PCB Assemblies,” and Jack Herring of Jiva Materials Ltd. spoke on “Transforming Electronics with Recyclable PCB Technology.” This column will review information and provide analysis from both presentations.
Dymax Renews Connecticut Headquarters Lease, Reinforces Long-Term Commitment to Local Community
08/08/2025 | DymaxDymax, a global manufacturer of rapid light-curing materials and equipment, is pleased to announce the renewal and extension of its corporate lease at its 318 Industrial Lane, Torrington, headquarters.