Aeris Joins 5G Open Innovation Lab as a Technology Partner to Help Drive Early Adoption and Innovation of 5G Technology
May 20, 2020 | GlobeNewswireEstimated reading time: 1 minute
Aeris, a technology leader in the Internet of Things (IoT), announced that it has joined the newly launched, Seattle-based, 5G Open Innovation Lab, an ecosystem for developers, enterprises, carriers and technology leaders, focused on helping startups utilize 5G to develop new capabilities, use cases and market categories.
Aeris will share its deep technical knowledge, developed over 20+ years of experience deploying complex IoT programs for Fortune 500 companies, with Lab members looking to develop IoT applications and use cases employing 5G technology. The company will work closely with the Lab’s founding partners, including Intel, T-Mobile, and other partners, to help entrepreneurs and developers gain access to engineering, technology and industry insights that will enable the startup community.
“We’re delighted to be an inaugural technology partner with the 5G Open Innovation Lab, working with the Lab as a mentor and technical advisor,” said Syed Zaeem Hosain, co-founder and CTO of Aeris. “Aeris has already been active in supporting the low power LTE-M, WAN portion of 5G, enabling services like propane tank capacity monitoring, smart metering, and smart homes. Near term, these low-usage applications will be one of the drivers in expanding the use and deployment of 5G. But over the longer term, we expect significant growth to come from high-usage, low-latency applications such as autonomous cars and virtual reality. We look forward to working with the Lab on future applications incorporating IoT and 5G and to further realizing its potential.”
Unique to the Lab’s approach is its focus on unifying an independent ecosystem by bringing together technology, financial and community partners and forward-thinking customers from industries such as media and entertainment, transportation, oil and gas, manufacturing, healthcare and retail.
“The 5G OI Lab is an extraordinary opportunity for developers to work directly with technology and business leaders to design and bring to life their vision and dreams for new 5G applications,” said Jim Brisimitzis, managing partner of the 5G OI Lab. “This is not just any startup program. We are building a true partner ecosystem that will bring knowledge, resources and capital together to change the world in profound ways.”
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
High Density Packaging User Group Announces ASKPCB Membership
11/03/2025 | HDP User GroupHigh Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
KYZEN Honored with 2025 Step-by-Step Excellence Award for Its Innovative ANALYST² Process Control System
10/31/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce that its ANALYST² Process Control System has won a 2025 Step-by-Step Excellence Award (SbSEA).
LPKF Delivers Key Strategic Technology to Fraunhofer's Glass Panel Technology Group
10/29/2025 | LPKFLPKF Laser & Electronics SE is one of the initiators of the Glass Panel Technology Group (GPTG), a consortium encompassing the entire process chain for advanced semiconductor packaging with glass substrates.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.