TAKAYA Dual-Sided Flying Probe Tester Chosen by ACTIA Electronics Inc.
June 2, 2020 | TakayaEstimated reading time: 1 minute
TAKAYA announces the sale of an APT-1600FD-A Advanced Flying Probe test system for assembled PCBAs to ACTIA Electronics Inc. for their new high-mix production facility in Romulus, Michigan. ACTIA specializes in the design, development and manufacturing of electronics for the automotive, aeronautics, rail, telecommunications, and energy industries.
The APT-1600FD-A provides average head-speed increases of up to 50% with throughput improvements of 30-50% over existing models, making it the industry’s fastest flying-probe test system. The APT-1600FD incorporates a new 10-flying-Z-axis design, including 4 vertical flying probes that provide unequaled access to test points where conventional angled probes fail to contact. Its 6 top side and 4 bottom side flying probes deliver unprecedented speed and performance. TAKAYA is the inventor and industry leader in flying-probe test technology for more than 25 years.
“ACTIA continues to grow its global footprint as a full-service design, development and manufacturing partner to its customers,” stated Adam Ramouni, Chief Executive Officer for ACTIA. “We continue to invest in leading technologies like TAKAYA as we grow and add capability. Our new manufacturing facility, focused on the automotive industry, will feature state-of-the-art production equipment,” he added.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung.
Foxconn, ElectroMobility Poland in Strategic Partnership to Develop Electric Vehicle Ecosystem
05/08/2026 | FoxconnHon Hai Technology Group (Foxconn) plans to accelerate the development of clean mobility in the European region in strategic partnership with state-backed ElectroMobility Poland S.A. (EMP), the key driver of an ambitious initiative to raise the technological and operational capabilities of the electric vehicle ecosystem in Poland and the broader region.
Flex Plans Cloud and Power Unit Spin-Off
05/08/2026 | FlexFlex announced that its Board of Directors has unanimously approved moving forward with a plan to spin off its Power and Cloud portfolio from Flex, creating two independent, publicly traded companies, each optimally positioned to serve their customers and create value for their shareholders.
Global Electronics Association to Testify at the Office of the US Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.