Eight U.S. Manufacturers Selected to Make NASA COVID-19 Ventilator
June 1, 2020 | NASA JPLEstimated reading time: 1 minute

After receiving more than 100 applications, NASA's Jet Propulsion Laboratory (JPL) in Southern California has selected eight U.S. manufacturers to make a new ventilator tailored for coronavirus (COVID-19) patients.
The prototype, which was created by JPL engineers in just 37 days, received an Emergency Use Authorization from the Food and Drug Administration on April 30.
Called VITAL (Ventilator Intervention Technology Accessible Locally), the high-pressure ventilator was designed to use one-seventh the parts of a traditional ventilator, relying on parts already available in supply chains. It offers a simpler, more affordable option for treating critical patients while freeing up traditional ventilators for those with the most severe COVID-19 symptoms. Its flexible design means it also can be modified for use in field hospitals.
The Office of Technology Transfer and Corporate Partnerships at Caltech, which owns the patents and software for VITAL, is offering a free license for the device. Caltech manages JPL for NASA.
The U.S. companies selected for licenses are:
- Vacumed, a division of Vacumetrics, Inc. in Ventura, California
- Stark Industries, LLC in Columbus, Ohio
- MVent, LLC, a division of Minnetronix Medical, in St. Paul, Minnesota
- iButtonLink, LLC in Whitewater, Wisconsin
- Evo Design, LLC in Watertown, Connecticut
- DesignPlex Biomedical, LLC in Fort Worth, Texas
- ATRON Group, LLC in Dallas
- Pro-Dex, Inc. in Irvine, California
"The VITAL team is very excited to see their technology licensed," said Leon Alkalai, manager of the JPL Office of Strategic Partnerships and a member of the VITAL leadership team. "Our hope is to have this technology reach across the world and provide an additional source of solutions to deal with the on-going COVID-19 crisis."
JPL now is evaluating international manufacturers from countries as diverse as Brazil, Mexico, India and Malaysia.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.