Ventec High-CTI Substrate Drives Increased Vehicle Electrification
June 4, 2020 | Ventec International Group Co., Ltd.Estimated reading time: 1 minute

The increasingly complex typical vehicle electrical infrastructure, with many electronic control units (ECUs) positioned in harsh underhood environments where high humidity, -temperatures and atmospheric contaminants are expected, demands high reliability and durable materials for highest safety. Ventec International Group Co., Ltd. (6672 TT) has developed a high-CTI substrate (VT-441C) that offers an environmentally friendly, high-performance copper clad laminate that creates a stable and reliable platform on which to build ECU circuitry.
Increased electrification of vehicles is a trend now firmly entrenched, enabling more features, greater economy, superior reliability. ECU’s are positioned in harsh and distributed throughout the vehicle managing functions from critical safety systems such as airbag or ABS controllers to engine management and comfort features such as electric windows and electric seats. Reliability and thermal management is a must, so paying attention to the properties of materials at the substrate level is the first step towards achieving the most stringent performance targets.
The solution begins with high-performance substrate materials such as Ventec’s VT-441C high-CTI substrate that ensures reliability in the presence of high applied voltages in harsh and humid environments. With a Grade 0 (>600) Comparative Tracking Index (CTI) and a glass transition temperature (Tg) of 155oC, the versatile halogen-free material is the perfect choice for use in extreme high-temperature/humidity applications.
VT-441C is available in sheet or panel form with core thicknesses of 0.004” (0.10mm) to 0.200” (5mm).
Ventec International is a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions. Further information about Ventec’s solutions and the company’s wide variety of products is available at www.venteclaminates.com and/or by downloading the Ventec APP.
About Ventec International Group
Ventec International Group Co., Ltd. (6672 TT) is a premier supplier to the Global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper clad glass reinforced and metal backed substrates. Ventec materials, which include high-quality enhanced FR4, high-speed/low-loss- & high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support-network. For more information, visit www.venteclaminates.com.
Suggested Items
Trouble in Your Tank: Can You Drill the Perfect Hole?
07/07/2025 | Michael Carano -- Column: Trouble in Your TankIn the movie “Friday Night Lights,” the head football coach (played by Billy Bob Thornton) addresses his high school football team on a hot day in August in West Texas. He asks his players one question: “Can you be perfect?” That is an interesting question, in football and the printed circuit board fabrication world, where being perfect is somewhat elusive. When it comes to mechanical drilling and via formation, can you drill the perfect hole time after time?
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.