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AT&S Fights Energy Losses in Microelectronics; Joins CPES
June 9, 2020 | AT&SEstimated reading time: 1 minute
Energy plays a crucial role in microelectronics. As electronic components are becoming increasingly more powerful, they also require more energy. Scientists and technology companies therefore aim to develop methods and technologies to generate more energy and/or reduce energy requirements.
AT&S is now a member of one of the world’s leading research centres for power electronics and has joined the “Center for Power Electronics Systems” (CPES) of Virginia Tech (Blacksburg/Virginia). CPES comprises the “Who is Who” of the American and in part also the Asian power electronics market and focuses its research activities on improving the processing and distribution of electric energy. The fields of research range from microelectronics and battery-powered vehicles to regional and national electricity distribution systems. Among other things, CPES developed, together with five universities and many industrial companies, the IPEM (Integrated Power Electronics Module), a standard module that has revolutionised power electronics.
Energy consumption is one of the main challenges in the digital world. “The loss of energy in the form of heat is one of the greatest inefficiencies in technology,” says Hannes Voraberger, Head of R&D at AT&S. “CPES enjoys a good reputation worldwide for the progress in its research activities and has worked successfully with industry for many years.” Together with CPES and the know-how of numerous partners, the aim is to find solutions to overcome these challenges and develop new technologies to reduce the energy consumption and electricity required by microelectronics. An example of this is the so-called IC substrate core, the heart of IC substrates, which act as a "translator" between the microstructures of the circuit board and the nanostructures of microchips and which are used, for example, in high-performance computers. The IC substrate cores manufactured in Leoben are designed in such a way that the energy consumption in the chip can be reduced or less energy is required for the entire data transmission.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.
HDI PCB Market Poised for Explosive Growth, Projected to Hit $34.23 Billion by 2032
09/04/2025 | Globe NewswireAccording to Coherent Market Insights (CMI), the global HDI PCB market size is projected to expand at a CAGR of 8.3% over the forecast period, reaching USD 19.59 Bn in 2025 and USD 34.23 Bn by 2032.
Kris Moyer Discusses His Emerging Design Technologies Class
09/04/2025 | Marcy LaRont, I-Connect007Kris Moyer, a design instructor for the Global Electronics Association, will be teaching his advanced PCB design class this fall. If you’re ready to level up your design education, you won’t want to miss this interview. The PCB Design for Emerging Design Technologies course is designed to provide the skills necessary to create PCB/PBA designs that require cutting-edge emerging design technologies and comply with all necessary IPC standards, including new standards being developed in this area.
NOTE Appoints Bahare Mackinovski Chief Sales and Marketing Officer
09/04/2025 | NOTEAs part of NOTE’s strategic focus on growth and customer value, the company is now strengthening its executive management team by appointing Bahare Mackinovski as Chief Sales and Marketing Officer.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.