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GOEPEL electronic Presents New Series of Affordable 3D AOI Systems
June 18, 2020 | GOEPEL ElectronicEstimated reading time: 1 minute
Large and small electronics manufacturers are subject to relentless demands for reduced cost and improve quality. To meet these demands the GOEPEL electronic has launched two new Automatic Optical Inspection Systems. The 3D XE series of AOI platforms are characterised by low acquisition costs whilst still delivering full 3D inspection functionality.
The series consists of the stand-alone system Basic Line · 3D XE and the inline system Advanced Line · 3D XE. Flexible interfaces such as Hermes or PULSE allow production line integration of the inline version; for smaller quantities, the offline 3D AOI system with manual loading is an attractive solution. In addition, both systems can be used as full 3D solder paste inspection systems (SPI). Thus configuration as an inspection island offers a highly efficient and flexible production environment. (especially for the Advanced Line · 3D XE).
3D XE series platforms are controlled using the latest PILOT AOI software and MagicClick for AI-based, fully automatic creation and optimization of inspection programs. This functionality enables the system to inspect new assemblies within a few minutes and without any component library. For manufacturing service providers with a large variety of products this is especially important. It guarantees a high degree of cost-effective use even for the smallest of board quantities and saves up to 80% of program creation and optimization time.
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Brent Fischthal - Koh YoungSuggested Items
Indium Expert to Present on Advancements in Bi-free In-containing Lower-Temperature Solder at ICEE 2025
12/11/2025 | Indium CorporationIndium Corporation’s Senior R&D Manager of the Alloy Group, Hongwen Zhang, Ph.D., will present on the company’s award-winning Durafuse® Technology during the IEEE International Conference on Emerging Electronics (ICEE), December 13–16, in Bengaluru, India.
Nordson Rolls Out New Feature for Auto Sector
12/09/2025 | Nolan Johnson, SMT007 MagazineAn ever-widening variety of components and denser board features are creating a gap for new equipment. Just as stencils are moving to multi-thickness panels for complex applications, soldering hardware is evolving to become more precise and integrated into the entire manufacturing line. Jeanine Norlin and Roberta Foster-Smith, representatives of Nordson Electronics Solutions, discuss the current state and implications of selective soldering, including a case study of a customer that made a change. How will selective soldering fit into your future?
Nolan’s Notes: A Tribute to Iola—and Automation
12/02/2025 | Nolan Johnson -- Column: Nolan's NotesIn the 1960s and ’70s, when the west side of the Portland, Oregon, metro area was dominated by Tektronix, my grandmother worked as one of the “assembly ladies.” Known as “Tek,” the company was an economic juggernaut, driving the economy of the cities of Beaverton, Tigard, and Hillsboro. The only employer larger than Tektronix was the state of Oregon itself; virtually every Portlander had some connection to Tek.
Indium Expert to Tackle Reliability Challenges in AI and High-Performance Computing at EPTC 2025
11/27/2025 | Indium CorporationIndium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). The conference will be held December 2-5, 2025, in Singapore.
Altus Supports Concurrent Technologies’ Production Expansion with Advanced Inline Vapour Phase System
11/26/2025 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics industry, has successfully supplied Concurrent Technologies Plc (Concurrent), a designer and manufacturer of mission-critical embedded computing solutions, with their second ASSCON vapour phase soldering system, the innovative VP2100-100 inline unit.