Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
GOEPEL electronic Presents New Series of Affordable 3D AOI Systems
June 18, 2020 | GOEPEL ElectronicEstimated reading time: 1 minute
Large and small electronics manufacturers are subject to relentless demands for reduced cost and improve quality. To meet these demands the GOEPEL electronic has launched two new Automatic Optical Inspection Systems. The 3D XE series of AOI platforms are characterised by low acquisition costs whilst still delivering full 3D inspection functionality.
The series consists of the stand-alone system Basic Line · 3D XE and the inline system Advanced Line · 3D XE. Flexible interfaces such as Hermes or PULSE allow production line integration of the inline version; for smaller quantities, the offline 3D AOI system with manual loading is an attractive solution. In addition, both systems can be used as full 3D solder paste inspection systems (SPI). Thus configuration as an inspection island offers a highly efficient and flexible production environment. (especially for the Advanced Line · 3D XE).
3D XE series platforms are controlled using the latest PILOT AOI software and MagicClick for AI-based, fully automatic creation and optimization of inspection programs. This functionality enables the system to inspect new assemblies within a few minutes and without any component library. For manufacturing service providers with a large variety of products this is especially important. It guarantees a high degree of cost-effective use even for the smallest of board quantities and saves up to 80% of program creation and optimization time.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.