Intel: AI and Analytics Platform with New Processor, Memory, Storage and FPGA Solutions
June 18, 2020 | IntelEstimated reading time: 3 minutes
What’s New: Intel introduced its 3rd Gen Intel® Xeon® Scalable processors and additions to its hardware and software AI portfolio, enabling customers to accelerate the development and use of artificial intelligence (AI) and analytics workloads running in data center, network and intelligent-edge environments. As the industry’s first mainstream server processor with built-in bfloat16 support, Intel’s new 3rd Gen Xeon Scalable processors make AI inference and training more widely deployable on general-purpose CPUs for applications that include image classification, recommendation engines, speech recognition and language modeling.
Why It’s Important: AI and analytics open new opportunities for customers across a broad range of industries, including finance, healthcare, industrial, telecom and transportation. IDC predicts that by 2021, 75% of commercial enterprise apps will use AI1. And by 2025, IDC estimates that roughly a quarter of all data generated will be created in real time, with various internet of things (IoT) devices creating 95% of that volume growth2.
Unequaled Portfolio Breadth and Ecosystem Support for AI and Analytics: Intel’s new data platforms, coupled with a thriving ecosystem of partners using Intel AI technologies, are optimized for businesses to monetize their data through the deployment of intelligent AI and analytics services.
- New 3rd Gen Intel Xeon Scalable Processors: Intel is further extending its investment in built-in AI acceleration in the new 3rd Gen Intel Xeon Scalable processors through the integration of bfloat16 support into the processor’s unique Intel DL Boost® technology. Bfloat16 is a compact numeric format that uses half the bits as today’s FP32 format but achieves comparable model accuracy with minimal — if any — software changes required. The addition of bfloat16 support accelerates both AI training and inference performance in the CPU. Intel-optimized distributions for leading deep learning frameworks (including TensorFlow and Pytorch) support bfloat16 and are available through the Intel AI Analytics toolkit. Intel also delivers bfloat16 optimizations into its OpenVINO® toolkit and the ONNX Runtime environment to ease inference deployments.The 3rd Gen Intel Xeon Scalable processors (code-named “Cooper Lake”) evolve Intel’s 4- and 8-socket processor offering. The processor is designed for deep learning, virtual machine (VM) density, in-memory database, mission-critical applications and analytics-intensive workloads. Customers refreshing aging infrastructure can expect an average estimated gain of 1.9 times on popular workloads3 and up to 2.2 times more VMs4 compared with 5-year-old 4-socket platform equivalents.
- New Intel Optane persistent memory: As part of the 3rd Gen Intel Xeon Scalable platform, the company also announced the Intel Optane™ persistent memory 200 series, providing customers up to 4.5TB of memory per socket to manage data intensive workloads, such as in-memory databases, dense virtualization, analytics and high-powered computing.
- New Intel 3D NAND SSDs: For systems that store data in all-flash arrays, Intel announced the availability of its next-generation high-capacity Intel 3D NAND SSDs, the Intel SSD D7-P5500 and P5600. These 3D NAND SSDs are built with Intel’s latest triple-level cell (TLC) 3D NAND technology and an all-new low-latency PCIe controller to meet the intense IO requirements of AI and analytics workloads and advanced features to improve IT efficiency and data security.
- First Intel AI-optimized FPGA: Intel disclosed its upcoming Intel Stratix® 10 NX FPGAs, Intel’s first AI-optimized FPGAs targeted for high-bandwidth, low-latency AI acceleration. These FPGAs will offer customers customizable, reconfigurable and scalable AI acceleration for compute-demanding applications such as natural language processing and fraud detection. Intel Stratix 10 NX FPGAs include integrated high-bandwidth memory (HBM), high-performance networking capabilities and new AI-optimized arithmetic blocks called AI Tensor Blocks, which contain dense arrays of lower-precision multipliers typically used for AI model arithmetic.
- OneAPI cross-architecture development for ongoing AI innovation: As Intel expands its advanced AI product portfolio to meet diverse customer needs, it is also paving the way to simplify heterogeneous programming for developers with its oneAPI cross-architecture tools portfolio to accelerate performance and increase productivity. With these advanced tools, developers can accelerate AI workloads across Intel CPUs, GPUs and FPGAs, and future-proof their code for today’s and the next generations of Intel processors and accelerators.
- Enhanced Intel Select Solutions portfolio addresses IT’s top requirements: Intel has enhanced its Select Solutions portfolio to accelerate deployment of IT’s most urgent requirements highlighting the value of pre-verified solution delivery in today’s rapidly evolving business climate. Announced today are three new and five enhanced Intel Select Solutions focused on analytics, AI and hyper-converged infrastructure. The enhanced Intel Select Solution for Genomics Analytics is being used around the world to find a vaccine for COVID-19 and the new Intel Select Solution for VMware Horizon VDI on vSAN is being used to enhance remote learning.
Suggested Items
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.
Smart Automation: The Power of Data Integration in Electronics Manufacturing
06/24/2025 | Josh Casper -- Column: Smart AutomationAs EMS companies adopt automation, machine data collection and integration are among the biggest challenges. It’s now commonplace for equipment to collect and output vast amounts of data, sometimes more than a manufacturer knows what to do with. While many OEM equipment vendors offer full-line solutions, most EMS companies still take a vendor-agnostic approach, selecting the equipment companies that best serve their needs rather than a single-vendor solution.
Keysight, NTT, and NTT Innovative Devices Achieve 280 Gbps World Record Data Rate with Sub-Terahertz for 6G
06/17/2025 | Keysight TechnologiesKeysight Technologies, Inc. in collaboration with NTT Corporation and NTT Innovative Devices Corporation (NTT Innovative Devices), today announced a groundbreaking world record in data rate achieved using sub-THz frequencies.
Priority Software Announces the New, Game-Changing aiERP
06/12/2025 | Priority SoftwarePriority Software Ltd., a leading global provider of ERP and business management software announces its revolutionary aiERP, leveraging the power of AI to transform business operations.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.