Smart Automation: The Journey of a Component Through an SMT Factory
Powering the Future: Why Thermal Management Defines the Future of Electronics
Standard of Excellence: Engineering Is the New Sales—How Technical Collaboration Wins Business
MacDermid Alpha Launches Ultra-Low Temperature Solder, 5G Solutions at Productronica China 2020
June 18, 2020 | MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes
The Assembly Solutions division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will be introducing its ultra-low temperature solder and 5G solutions at the Productronica China show from July 3-5, 2020, at the National Exhibition and Convention Center in Shanghai.
MacDermid Alpha’s new ultra-low temperature solder paste ALPHA® OM-220 paired with the ALPHA ULT1 alloy has been designed for soldering low temperature components and substrates. This innovative chemistry enables peak reflow temperatures below 150 °C, making it ideal for the soldering of heat sensitive components and sub-assemblies. In addition, ALPHA OM-220 permits cascaded / hierarchical soldering, as well as novel hermetic sealing solutions.
MacDermid Alpha will also exhibit its innovative specialty processes and materials from its Circuitry, Assembly and Semiconductor Solutions divisions, that support the entire 5G electronics supply chain. The Circuitry Solutions division will introduce its co-developed solutions for 5G circuitry and niche metallization, the Assembly Solutions division will show high performance joining materials for 5G related electronics assemblies and the Semiconductor Solutions division will highlight its advanced electronics materials for 5G processing power.
MacDermid Alpha will also be featuring the following solutions at Booth A201, Hall 5.1:
- Sintering Process Solutions – Sintering materials to enhance reliability, lower the TCO and offer more efficiency.
- Flexible, Formable & Printed Electronics Solutions – Enabling soldering on PET F-PCB’s, ideal for next generation automotive, HMI, in-mold 3D electronics, printed sensors and circuits.
- ALPHA HiTech Adhesives Solutions – One-stop bonding platform designed for automotive, medical, smartphone, camera module and white goods assemblies.
- Low Temperature Solutions – Innovative low temperature solder to mitigate high temperature induced warpage in assemblies.
- Void Reduction Solutions – Ultra-low voiding solder paste that enables less than 10% voiding on bottom termination components.
- Wave Soldering Solutions – Silver free alloys to lower the total cost of ownership and OSP friendly fluxes to improve hole-fill and wetting performance.
For more information on MacDermid Alpha’s revolutionary soldering materials and 5G Solutions, please visit our booth at Productronica China Hall 5.1 A201 or visit MacDermidAlpha.com.
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Kester and MacDermid Enthone brands, we provide solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
SMTA Ultra HDI Symposium, Day 2: Fragile Supply Chains, Fierce Innovation
04/14/2026 | Marcy LaRont, I-Connect007The Arizona weather yielded another beautiful day as we gathered for the second day of SMTA’s annual UHDI symposium. After the first full day discussing the role of AI in business and the how-tos of implementation, Avondale Mayor Mike Pineda kicked off day two, proud to showcase his city and to declare its important place in the continued development of the West Valley, an increasingly important area for tech and manufacturing.
KYZEN Focuses on Aqueous and Stencil Cleaning Solutions at SMTA Monterrey Expo and Tech Forum
04/10/2026 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum.
Solder Paste Innovations for Enhanced Reliability from MacDermid Alpha Electronics Solutions
04/10/2026 | Real Time with... APEX EXPOJason Fullerton of MacDermid Alpha Electronics Solutions discusses innovative alloys like Innolot MXE, low-temperature solder options, and polymer reinforcement strategies. Learn how these solutions address the growing demands of high-performance computing and larger component assemblies, ensuring optimal performance and cost-effectiveness.
Frank Sommer Discusses Selective Soldering Innovations for EVs
04/10/2026 | Real Time with... APEX EXPODan Beaulieu sits down with Frank Sommer, a selective soldering expert from Nordson Electronics Solutions, to discuss the resurgence of selective soldering driven by electric vehicle manufacturing, and the need for robust through-hole component integration. He also introduces Nordson's innovative SELECT Synchro selective soldering machine, designed for enhanced throughput and flexibility.