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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Just Ask Happy: Two-Layer Low-Speed PCBs
July 3, 2020 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

In our latest survey, we have asked that our readers send in questions they might have for Happy Holden, and quite a few of them took us up on it! The questions that were posed run the gamut, covering technology, the worldwide electronics fabrication market, and everything in between. Enjoy.
If you would like to participate in this ongoing survey, please follow this link.
The following is today's question and Happy's answer:
Q: Why do many two-layer boards work in low-speed applications, signal integrity-wise?
A: Two-layer boards, properly designed, will even work in high-speed applications! Even a single-sided board will. If the signal rise times are slow, signal integrity does not enter in the solution.
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