Happy’s Tech Talk #37: New Ultra HDI Materials
It’s Only Common Sense: When Data Isn’t Enough, Trust Your Gut
Marcy’s Musings: Fueling the Workforce Pipeline
TRI to Unveil New High-Throughput AOI and AXI at productronica 2023
September 15, 2023 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join productronica 2023, which will be held at Messe München Center from November 14 – 17, 2023. Visit booth No. A2-139 to experience TRI's newly released test and inspection solutions.
TRI will unveil the newly released Ultra-High-Speed 3D AOI, TR7700QH SII, capable of inspecting at speeds of up to 80 cm²/sec, maintaining uncompromised Gauge R&R. The TR7700QH SII is powered by TRI's Smart Programming, AI Algorithms, and Metrology measurement capabilities. Also exhibiting will be the newly released high throughput 3D AXI, TR7600 SV, which offers up to 20% performance improvement compared to the award-winning TR7600 series. Powered by AI Algorithms, the high-speed 3D AXI can precisely detect Void defects.
TRI will showcase the newly released high-speed multi-angle 3D AOI, TR7500QE Plus, equipped with four 20MP side cameras and 1 top high-resolution camera. TRI's lineup will include the enhanced 3D SPI TR7007DI Plus, the high-end 3D AXI TR7600F3D SII, and the Multi-core ICT with In-System LED Analysis function TR5001Q SII INLINE.
The AI solutions from TRI include the AI training tool, the AI Station, Verify Host, AI Smart Programming, and more. TRI Test and Inspection solutions comply with Industry 4.0 standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.
TRI invites you to visit booth No. A2-139 at productronica 2023. Don't miss the opportunity to discuss with our experts how TRI solutions can enhance your production yield rate, reduce operational costs, and increase efficiency.
Share on:
Suggested Items
The Test Connection, Inc. to Showcase Advanced Testing Solutions at SMTA Austin Expo & Tech Forum
02/04/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is excited to announce its participation in the SMTA Austin Expo & Tech Forum on February 6, 2025 in Austin, Texas.
Nolan's Notes: Find the Help You Need—Accessing Technical Resources
02/04/2025 | Nolan Johnson -- Column: Nolan's NotesSome close friends of mine have a card catalog in their family room—with the cards still in it. It’s just a novelty now, but it wasn’t that long ago that the card catalog was the end-all, be-all of research resources. As a college student, I remember something like two dozen or more of the very large card catalog cabinets in the Oregon State University Library. It’s not lost on me that my friend’s card catalog “liberated” from the university is a snapshot of that particular knowledge base at that particular moment in time. Today’s access to a library’s contents have changed dramatically.
Happy’s Tech Talk #37: New Ultra HDI Materials
02/03/2025 | Happy Holden -- Column: Happy’s Tech TalkSome new materials have been introduced in the past year for ultra high density interconnect (UHDI), a convenient title for developing high density technologies. They have received labels like semiconductor-like PCBs (SLPs), redistribution layers (RDL), flip-chip ball grid array (FCBGA), and interposers. The early 2000s saw the creation of these organic substrates for flip-chip IC packaging. The initial construction was composed of a BT core with build-up layers of the Ajinomoto Build-up Film (ABF)
Mind Meld: Brian Chislea and AJ Arriaga Share Their Fascinating Experience in IPC's Mentorship Program
01/28/2025 | Michelle Te, IPC CommunityIPC’s Emerging Engineer program provides professionals an opportunity early in their careers to learn from dedicated industry volunteers participating in standards development. Two participants in the program—Brian Chislea, Dow Chemical, mentor to AJ Arriaga, Summit Interconnect—share their experiences in the program in a series of articles. We will follow them through their three years in the mentorship. This is the first in the series.
The Test Connection, Inc. Launches The Training Connection to Address Critical Test Engineering and Development Needs
01/24/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is excited to announce the launch of its newest venture, The Training Connection, LLC, a company dedicated to addressing the growing need for practical and effective training in test engineering and development. With a focus on critical methodologies such as Design for Test (DFT) and IPC standards, The Training Connection is poised to empower professionals with the tools and expertise they need to excel.