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TRI to Unveil New High-Throughput AOI and AXI at productronica 2023
September 15, 2023 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join productronica 2023, which will be held at Messe München Center from November 14 – 17, 2023. Visit booth No. A2-139 to experience TRI's newly released test and inspection solutions.
TRI will unveil the newly released Ultra-High-Speed 3D AOI, TR7700QH SII, capable of inspecting at speeds of up to 80 cm²/sec, maintaining uncompromised Gauge R&R. The TR7700QH SII is powered by TRI's Smart Programming, AI Algorithms, and Metrology measurement capabilities. Also exhibiting will be the newly released high throughput 3D AXI, TR7600 SV, which offers up to 20% performance improvement compared to the award-winning TR7600 series. Powered by AI Algorithms, the high-speed 3D AXI can precisely detect Void defects.
TRI will showcase the newly released high-speed multi-angle 3D AOI, TR7500QE Plus, equipped with four 20MP side cameras and 1 top high-resolution camera. TRI's lineup will include the enhanced 3D SPI TR7007DI Plus, the high-end 3D AXI TR7600F3D SII, and the Multi-core ICT with In-System LED Analysis function TR5001Q SII INLINE.
The AI solutions from TRI include the AI training tool, the AI Station, Verify Host, AI Smart Programming, and more. TRI Test and Inspection solutions comply with Industry 4.0 standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.
TRI invites you to visit booth No. A2-139 at productronica 2023. Don't miss the opportunity to discuss with our experts how TRI solutions can enhance your production yield rate, reduce operational costs, and increase efficiency.
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EIPC Technical Snapshot: Sustainability in Electronics Manufacturing
11/06/2025 | Pete Starkey, I-Connect007EIPC selected the highly topical issue of sustainability in electronics manufacturing for the 24th Technical Snapshot webinar on Oct. 29, with guest speakers Satoshi Konagai of Elephantech and Liisa Hakola of the VTT Technical Research Centre of Finland. The program was moderated by Kirsten Smit-Westenberg, executive director of EIPC, who also introduced each speaker.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
Life Is a Highway: A Family of 8 Turned the Entire U.S. Into a Learning and Working Environment
11/04/2025 | Steven Bowles, Lockheed MartinIt’s 6:45 a.m. in a modern A-frame cabin tucked into the misty edges of the Cascade Range in Arlington, Washington. I’ve just made a quick Nespresso, checked my calendar of virtual meetings, and verified the Airbnb’s Wi-Fi speed is holding steady. In the next room, my wife Lynsey corrals our six kids into breakfast while planning a day trip to Seattle’s Children’s Museum. By 7:30, I’m camera-ready in a makeshift office nook, leading a discussion on HDI PCB design for an IPC standards committee. After a busy day, our Bowles crew, ranging in age from 1 to 10 years old, is hands-on with activities and exhibits in the museum.
TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.