Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Keysight, WIN Semiconductors Collaborate to Cut Design Risk for High Frequency RF Components

07/01/2026 | Keysight Technologies
Keysight Technologies, Inc. and WIN Semiconductors Corp. announced a joint MMIC design workflow that enables GaN MMIC design houses to achieve first pass tapeout success.

IBM Debuts World’s First Sub-1 Nanometer Chip Technology

06/29/2026 | IBM
IBM unveiled a major semiconductor breakthrough with the introduction of the world’s first sub-1 nanometer (nm) chip technology, featuring a revolutionary transistor architecture at the 0.7 nm, or 7 angstrom node.

Microchip's Radiation-Tolerant Clock Generator Streamlines Spacecraft Timing

06/26/2026 | Microchip
Spacecraft timing systems must provide highly stable, precise signals for navigation, communications and scientific instruments, even when GNSS signals are weak or unavailable.

European Commission Approves €76 Million German State Aid for First-of-a-kind Semiconductor Testing Equipment Facility

06/25/2026 | European Commission
The European Commission has approved, under EU State aid rules, a €76 million German measure to support QuantumDiamonds GmbH to set up a new facility for the production of semiconductor testing equipment in Munich.

ChipAgents, AWS Partner to Advance AI-Powered Semiconductor Engineering

06/24/2026 | BUSINESS WIRE
ChipAgents, a leading provider of Agentic AI platforms in the semiconductor design industry, announced that it has joined the Amazon Web Services (AWS) Partner Network (APN), a global community of AWS Partners that leverage programs, expertise and resources to build, market and sell customer offerings.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in