-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Gentec Selects MIRTEC MV-3 OMNI Desktop 3D AOI Machine
July 7, 2020 | MIRTEC GmbHEstimated reading time: 1 minute

MIRTEC is pleased to announce that Gentec, a Québec-based design and manufacturing company specializing in rugged and reliable custom-made products and solutions in the fields of high-tech, power and power management electronics, has selected MIRTEC’s award-winning MV-3 OMNI Desktop 3D AOI system. The MV-3 OMNI is the perfect 3D Inspection Solution to strengthen Gentec’s commitment to uncompromised production quality.
“Since 1959, Gentec has been designing and manufacturing long-lasting, reliable, state-of-the-art electronics for the power and energy management sectors. The company has maintained its position as market leader thanks largely to its highly skilled employees and a commitment to customer satisfaction. In recent years, we have seen an increased number of US companies “offshoring” their Electronics Manufacturing to Canada. Working with Gentec is a great way for these companies to reduce costs without sacrificing quality. As proof that we make no compromise on quality, Gentec recently invested in a new MIRTEC MV-3 OMNI 3D AOI machine. The outstanding inspection capability of this system has resulted in a drastic reduction in manufacturing defect rates allowing us to pass on additional cost savings to our customers,” stated Christian Plourde, Gentec Operations Coordinator.
“Electronic Manufacturers are becoming ever more selective in purchasing equipment that will add value to their business and provide them with a much-needed edge in this highly competitive industry,” said Brian D’Amico, President of MIRTEC Corp. “An increasing number of manufacturers are relying upon MIRTEC’s award-winning 3D Automated Optical Inspection (AOI) machines to help increase profitability by improving production yields and reducing costly rework. We are extremely pleased to have been awarded Gentec’s 3D AOI business. We look forward to a long and prosperous relationship between our two organizations.”
MIRTEC’s MV-3 OMNI Desktop 3D AOI Machines are configured with the company’s exclusive OMNI-VISION® 3D Inspection Technology which combines a 15 Mega Pixel CoaXPress Camera System with MIRTEC’s revolutionary Digital Tri-Frequency Moiré 3D Technology to provide precision inspection of SMT devices on finished PCB assemblies. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as 3D solder fillet inspection post reflow. Fully configured the MV-3 OMNI machines feature four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel CoaXPress Top-Down Camera and an Eight (8) Phase COLOR Lighting System.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.