-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
ViTrox Introduces New Advanced 3D Solder Paste Inspection Solution
July 9, 2020 | ViTrox TechnologiesEstimated reading time: 2 minutes
ViTrox Technologies, a world-leading solution provider of innovative, advanced and cost-effective Automated Machine Vision inspection system and equipment for the Semiconductor and Electronics Assembly industries, is pleased to introduce the V310i Advanced 3D Solder Paste Inspection System (API) designed to cater for the need of integrated vision solution for Smart Manufacturing.
The Advanced 3D Solder Paste Inspection Solution plays an essential role in guaranteeing the quality and quantity of the solder paste printing in the SMT line. Solder paste printing is a complicated process and it contributes to defects from many factors. It depends on the volume of particle balls deposited on the pads to achieve a good product.
The V310i API system is a high speed and high-resolution 3D solder paste inspection system that enables high-accuracy inspection with the shortest cycle time. The system is integrated with many technological features, such as Advanced Warpage Compensation, Auto Pads and Component learning, Auto Warpage Mapping capabilities coupled with the machine to machine closed-loop features which have created significant value differentiation from other market players.
In order for users to cover all types of solder paste while the sizes of solder balls are getting smaller and smaller, the vision resolution of inspection becomes challenging than before. Therefore, ViTrox provides customers with the V310i API Solution that offers variable fine lens to prepare for customer selection based on their products for pads measurements of solder deposit. The accuracy of 3D measurement on Area, Volume, Height is able to reduce the rework cost and achieve high-quality product.
ViTrox also offers various solder paste inspection platforms to cover different production needs such as V310i 3D standard, V310i 3D XL and V310i 3D XXL. V310i 3D XL is a brand new model. This model is suitable to serve major industries such as communication, consumer electronics, automotive, medical industries with the capability of handling board weight up to 7 kg and 510 mm x 510 mm board size for Single Lane or 460 mm x 325 mm for Dual Lane. Meanwhile, 95% of V310i API parts are similar with V510i Advanced 3D Optical Inspection (AOI), thus, the V510i AOI and V310i API are able to share the same wear and tear spare parts to reduce the investment cost.
Overall, ViTrox debuts the complete SMT inspection solutions with of Advanced 3D Solder Inspection system that works hand in hand with V510i AOI, V810i Advanced 3D X-Ray Inspection (AXI) and V9i Advanced Robotic Vision (ARV) for the SMT manufacturing line.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.