EV Group Completes State-Of-The-Art Cleanroom
July 21, 2020 | EV GroupEstimated reading time: 2 minutes
EV Group, a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announces that it has completed construction of its new Cleanroom V building at its corporate headquarters in Austria.
Built from top to bottom with the latest cleanroom design and construction technology, the new building nearly doubles the cleanroom capacity at EVG’s headquarters, and will be used for product and process development, equipment demonstrations, prototyping and pilot-line production services. The Cleanroom V building, which is part of a 30 million Euro investment announced last year, will officially open in August.
The new Cleanroom V building is directly connected to EVG’s existing cleanroom and applications lab, and provides approximately 620 square meters of additional Class 10 cleanroom floor space. The new building also houses a modern training center with multiple dedicated areas for training customers and field service engineers on EVG equipment platforms. As part of the expansion investment, the existing cleanroom and applications lab facility have also been upgraded, including the creation of redundant systems to ensure the highest availability and new safety features.
Enhancing EVG’s centers of technology excellence
The added capacity afforded by the new Cleanroom V building will strengthen the capabilities of EVG’s NILPhotonics® Competence Center and Heterogeneous Integration Competence Center™, which provide world-class process development services, and serve as open access innovation incubators for customers and partners across the microelectronics supply chain. Through these centers of technology excellence, EVG helps customers to accelerate technology development, minimize risk, and develop differentiating technologies and products through the implementation of nanoimprint lithography and heterogeneous integration, respectively, while guaranteeing the highest IP protection standards that are required for working on pre-release products.
“We are extremely proud of the technical innovation and know-how that went into the construction of this new cleanroom. It is truly a world-class, state-of-the-art facility down to the smallest details—arguably on par with some of the most technically advanced cleanrooms in Europe,” stated Markus Wimplinger, corporate technology development & IP director at EV Group. “For EVG, this new facility will greatly enhance our ability to co-develop future applications and technologies with our customers. In particular, we see it benefiting our competence centers, which have seen particularly strong activity and demand. The unique services offered at our NILPhotonics and Heterogeneous Integration Competence Centers enable our customers and partners to shorten development cycles and create novel products in these critical application areas.”
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
High Density Packaging User Group Announces ASKPCB Membership
11/03/2025 | HDP User GroupHigh Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
KYZEN Honored with 2025 Step-by-Step Excellence Award for Its Innovative ANALYST² Process Control System
10/31/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce that its ANALYST² Process Control System has won a 2025 Step-by-Step Excellence Award (SbSEA).
LPKF Delivers Key Strategic Technology to Fraunhofer's Glass Panel Technology Group
10/29/2025 | LPKFLPKF Laser & Electronics SE is one of the initiators of the Glass Panel Technology Group (GPTG), a consortium encompassing the entire process chain for advanced semiconductor packaging with glass substrates.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.