Velodyne Lidar Inc. Announces Patent License Agreement With Hesai Photonics
July 21, 2020 | Business WireEstimated reading time: Less than a minute
Velodyne Lidar, Inc. announced a long-term global licensing agreement with Hesai Photonics Technology Co., Ltd. encompassing 360° surround-view lidar sensors. As a result of this agreement, Velodyne and Hesai have agreed to dismiss current legal proceedings in the U.S., Germany and China that exist between the two companies.
“We think this agreement will expand the adoption of lidar world-wide and save lives,” says David Hall, Velodyne Founder and Chairman of the Board.
The surround-view lidar is an essential sensor for autonomous driving and it is purchased world-wide by car makers as they pursue the autonomous market. Since its invention by David Hall in 2005, the technology has found many more applications in shuttles, industrial robotics and smart cities. The relationship with Hesai is the third major licensing agreement for Velodyne’s fundamental lidar technology.
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).