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Advanced Electronics Packaging Digest

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Target Condition: The Modern Masters of Signal Integrity and AI-driven Design

05/21/2026 | Kelly Dack -- Column: Target Condition
Signal integrity (SI) in PCB design has moved from a niche engineering concern to the defining factor in whether modern electronics succeed or fail. As data rates push beyond PAM4 (4-level 112G) gigabit territory and SerDes components exhibit edge speeds as fast as 50–100 picoseconds, PCBs behave less like collections of simple traces and more like complex electromagnetic systems.

L3Harris, Shield AI Achieve Breakthrough in Autonomous Electronic Warfare

03/16/2026 | L3Harris Technologies
L3Harris Technologies and Shield AI have successfully demonstrated a first-of-its-kind integration combining L3Harris’ electromagnetic battle management ecosystem known as Distributed Spectrum Collaboration and Operations (DiSCO™) with Shield AI’s Hivemind mission-autonomy software.

Amca Acquires Payne Magnetics, Strengthening its Power Electronics Capabilities

02/20/2026 | PRNewswire
Amca, a Los Angeles-based aerospace and defense company, has acquired Payne Magnetics of Covina, California from its second-generation owner, Jon Payne.

JBNU Researchers Propose Hierarchical Porous Copper Nanosheet-Based Triboelectric Nanogenerators

01/08/2026 | PRNewswire
In recent years, two-dimensional (2D) single-crystalline metal nanosheets have emerged as a promising next-generation platform for self-powered electronics.

Thales Wins Two PERSEUS Awards for EW and AI Innovations

12/01/2025 | Thales
Thales has received two major PERSEUS distinctions, awarded by the French Navy, the Délégation Générale de l'Armement (the French procurement agency) and the Agence de l’Innovation de Défense (Defence Innovation Agency).
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