Sondrel Looking for Electronic Designers to Become Chip Architects
July 29, 2020 | SondrelEstimated reading time: 2 minutes
Designing a large complex chip is not simply question of connecting together a set of IP blocks, according to Sondrel. There is considerable creativity required as well. “Just like a great building design needs a great architect, a great chip design needs a great chip architect,” explains Graham Curren, Sondrel’s CEO and Founder. “Electronic designers are very logical and precise but a chip architect needs to also be creative as well to be able to think of a range of different ways to solve a problem. Being able to use both the left and right halves of the brain is a rare skill in electronic design. We are actively looking for such people to join us as chip architects as they play a fundamental role in the creation of the big complex chip designs that we do.”
The real-world process of designing a big chip starts with a customer brief which can range from a simple outline of what is required through to a very detailed specification depending on the experience of the customer. Sondrel has a team of Solutions Architects that meet to discuss the brief in depth with the customer and create a feasibility study, which crystallises the design into a tangible form. This identifies the technologies and IP needed including which processor, the process node to be used, etc to provide the Power Performance Area summary, of which the Area is critically important as the size of the chip determines its final cost.
Once approved, the task is handed over to the front-end and back-end design teams with an Architect assigned to maintain a high-level view and guide the project as the keeper of the overall technical perspective. “Designing a complex chip can take a couple of years,” explained Rowan Naylor, a System on Chip Architect at Sondrel. “Features and specifications can change over this time -- often called feature creep. The Architect needs creativity to ensure that none of the changes impact on the overall design and functionality. New features typically mean new functionality, which can impact the design, so the task is to ensure that they don’t compromise the design operation or significantly impact the cost and timescales. It’s rather like having a large cloud of possible end solutions and collapsing the size of the cloud over the lifetime of the project to coalesce on the best solution, which requires a high level of creativity to maintain a variety of possible design outcomes simultaneously.”
A key part of the possibility cloud of solutions is the continual trade-offs of the best possible technical solution, which would be unfeasibly expensive, to find the timely, commercially viable solution that achieves the key performance requirements of the project. Rowan Naylor added, “Fortunately, Sondrel has a growing team of Architects with a wide variety of experience to draw upon so we meet regularly to discuss live projects and brainstorm creative ways to solve the wide variety of challenges that always arise with big complex chip designs. Those sessions are enormous fun as the creative energy is huge making them the highlight of the week.”
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.
The Shaughnessy Report: Winning the Signal Integrity Battle
09/09/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportWhen I first started covering this industry in 1999, signal integrity was the hip new thing in PCB design. Conference classes on signal integrity were packed to the walls, and an SI article was guaranteed to get a lot of reads.
The Signal Integrity Issue: Design007 Magazine September 2025
09/09/2025 | I-Connect007 Editorial TeamAs the saying goes, “If you don’t have signal integrity problems now, you will eventually.” This month, our experts share a variety of design techniques that can help PCB designers and design engineers achieve signal integrity.