The Government Circuit: News on Defense Electronics, Europe, and Sustainability
American Made Advocacy: Taking the Fight to Capitol Hill
Defense Speak Interpreted: SWaPing Nanosatellites for Defense Systems
Aurora Circuits on Ultra-Heavy Copper PCBs
August 3, 2020 | Dan Beaulieu, D.B. Management GroupEstimated reading time: 3 minutes
It’s always fun to talk with a company that can do something different—in this case, ultra-heavy copper PCBs, meaning over 20-ounce copper. Wanting to know more about this, I talked to Aurora Circuits Director of Business Development Thad Bartosz, who is one of our industry experts when it comes to ultra-heavy copper technology.
Dan Beaulieu: Thad, it’s good talking to you today. Let’s start with the basics. What is heavy copper?
Thad Bartosz: Heavy copper used to be defined as 4–5 ounce, but we do that for a snack. Aurora is capable of fabricating SS, NPTH, PTH, and multilayer types with up to 20-oz copper layers.
Beaulieu: What defines ultra-heavy copper?
Bartosz: Ounces of copper have been defined in ounces per square foot of area on the process panel. The thickness of the copper foil is based on 0.0014” per oz. Copper weights of 4–5 ounces are made with electrodeposited copper (ED), and ultra-heavy copper sheets are made with rolled annealed (RA) copper that must be treated to laminate to dielectrics used in fabrication.
Beaulieu: How many ounces of copper can you do at Aurora?
Bartosz: We have delivered PCBs with etched copper up to 20 ounces and would work with customers that may require any copper thickness.
Beaulieu: Why doesn’t every shop build this technology?
Bartosz: You need to have the proper equipment and process capabilities—some of these are customer or Aurora proprietary—so that you can fabricate a usable product that meets customer requirements.
Beaulieu: How did you get involved with this technology?
Bartosz: We have been building ultra-heavy copper products since 2003 when a customer asked if we could do this as they were having issues with their current source.
Beaulieu: What special equipment and processes do you have that allow you to build ultra-heavy copper boards?
Bartosz: As I mentioned earlier, these are processes that have been developed over years of sampling and production processing. We start with a sample run to establish a feasible process and then scale up for production. Etching is normally a big factor as well as machining, so you acquire equipment to properly process the PCB to make an acceptable finished product.
Beaulieu: What technology requires ultra-heavy copper?
Bartosz: Circuit boards that need high current or thermal dissipation like solar and wind power collection, aerospace/military, telecommunications, and automotive applications.
Beaulieu: What kind of end-products need it?
Bartosz: Some products include automotive junction boxes, battery management systems, and high-power circuits that have MOSFETs, IGBTs, and other high-current components, running hundreds of amps through the circuitry. For those who may not know, MOSFETs and IGBTs are a couple of power devices/components that can handle high-voltage and high-current needs. You will find them on inverters, converters, and power supplies.
Beaulieu: How do you think it will be used in the future?
Bartosz: Currently, designs have been made for power distribution, power collection, battery-powered transportation, and LED lighting. Future use will depend on new applications needed in the marketplace. You also need a supplier that changes with the market to meet these specialized needs. It will definitely be used more in the future.
Beaulieu: Is this kind of technology being designed right now?
Bartosz: Yes, it is still used in the automotive and power markets, such as new EV and autonomous vehicles where battery technology has higher current requirements and power-generation systems, solar, wind, or conventional types as their technology changes.
Beaulieu: How many ultra-heavy copper boards have you built?
Bartosz: Aurora has shipped over five million boards of single-sided, PTH, and multilayer designs over the last 10 years. Many of these were for junction boxes or battery systems in automobiles. For a few years, we shipped over 400,000 6/6 copper PCBs to China. We have processed over 800 tons (based on oz/sq ft) and over 1.7 million square feet without any EPA violations.
Beaulieu: Before we end, tell us a little bit about Aurora Circuits.
Bartosz: We have over 60 years of experience in printed circuit fabrication, providing advanced thermal management and interconnect technology solutions for PCB designs and specialty products. Product specialty areas include polymer thick-film (PTF) resistors, metal-clad materials for LED lighting and other markets, durable plating for contact areas, and, of course, ultra-heavy copper. We partner with companies to help them to maximize profitability and production sustainability.
Beaulieu: Thank you, Thad.
Bartosz: No problem, Dan.
Read more about Aurora Circuits and ultra-heavy copper PCBs here.
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.