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November SMT007 Magazine Explores the New Age of Sourcing

11/03/2026 | I-Connect007 Editorial Team
The November 2026 issue of SMT007 Magazine, “The New Age of Sourcing,” examines how EMS companies are gaining better visibility and control over purchasing, inventory, and supply chain costs. After years of disruption, sourcing teams are finding new ways to move beyond spreadsheets and put more complete, consistent information to work.

News Products Contact Search Amy Johnson Appointed President of GDIT

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ICT 2026 Annual Symposium Review (Part 1): What Lies Ahead?

10/22/2026 | Pete Starkey, FInstCT
It was a misty autumn morning on the outskirts of Coventry in the Midlands of England for the 2026 Annual Symposium of the Institute of Circuit Technology. ICT technical director Alun Morgan welcomed delegates and remarked upon the excellent attendance. Although there were plenty of familiar faces in the audience, an encouraging number of hands were raised when Morgan enquired who was there for the first time. Remarking that although the Institute had seen a lot of changes since it was founded in the 1970s, the time for reminiscing was in the bar and the purpose of the symposium was to talk about the future, hear some new ideas, and discuss where we were going as an industry.

October I-Connect007 Magazine Spotlights MKS Inc. and PCB Manufacturing Challenges

10/15/2026 | I-Connect007 Editorial Team
Go inside MKS Inc., explore Thailand’s growing PCB industry, and find practical guidance on design and manufacturing challenges, from signal integrity and ceramic substrates to putting AI into factory operations.

From Substrates to Systems: A Preview of the October Advanced Electronics Packaging Digest

10/14/2026 | I-Connect007
The October issue of Advanced Electronics Packaging Digest examines the technologies, investments, and strategic decisions shaping the future of advanced electronics manufacturing. From the evolution of semiconductor scaling and the integration challenges of high-frequency systems to the expansion of semiconductor capabilities in the United States and India, this issue explores how materials, packaging architectures, and manufacturing infrastructure are becoming interconnected.
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