The New Chapter: Navigating Maternity Leave in the Electronics Industry
American Made Advocacy: There's No Substitute for American-made Microelectronics
It’s Only Common Sense: When Will Big Companies Start Paying Their Bills on Time?
Cubic Awarded Contract to Demonstrate High Capacity Backbone System for U.S. Air Force
August 3, 2020 | Business WireEstimated reading time: 1 minute
Cubic Corporation announces its Cubic Mission Solutions business division was awarded a contract worth $38 million to deliver a Joint Aerial Layer Network (JALN) High Capacity Backbone (HCB) prototype for the U.S. Air Force (USAF). The HCB is a critical element of the JALN, designed to maintain network connectivity among joint forces across the aerial layer. Cubic’s offering for USAF will consist of integrated capabilities across its Protected Communications and Command and Control, Intelligence, Surveillance and Reconnaissance (C2ISR) portfolios.
“Cubic’s selection by the USAF is a testament to our team and partners’ continuous pursuit to build this critical warfighting network prototype,” said Mike Twyman, president of Cubic Mission Solutions. “Our innovations address aerial layer networking needs to ensure agile and resilient communications; we are honored USAF trusts in us to build a critical enabler for Joint All-Domain Command and Control (JADC2) capability.”
Cubic will deliver a high-capacity, extended range, self-organizing and self-healing JALN HCB that connects warfighters to a mission-optimized network of networks in satellite communications-challenged environments. Cubic’s solution will ensure network availability and resiliency in all environments, accelerate data delivery for increased decision speed and support advanced warfighting concepts.
“We are inspired by this opportunity to bring Cubic innovation into the JALN,” said Marja Phipps, director of business development, Cubic Mission Solutions. “Over the last decade, Cubic has partnered with government stakeholders and invested significantly in the development of assured network connectivity solutions. Our team is eager to deliver HCB operational utility to the joint warfighter.”
Cubic’s partners for HCB include Raytheon BBN and Expeditionary Engineering, who will provide advanced aerial networking technology and expertise.
Share on:
Suggested Items
Partial HDI: A Delicate Balance
10/30/2024 | I-Connect007 Editorial TeamPartial HDI can be the perfect solution for designers faced with escape routing from tight-pitch BGAs. But there are a variety of material, signal integrity, and DFM trade-offs to understand before you get fully into partial HDI. We asked Stephen Chavez to explain the fundamentals, as well as the details, of this promising process. Are you using partial HDI?
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
Designers Notebook: Implementing HDI and UHDI Circuit Board Technology
10/23/2024 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, circuit board technology has undergone significant changes in both the fabrication process method and the criteria for base material selection. The reason behind these changes is the new high-function semiconductor package families that require more terminals than their predecessors and a significantly narrower terminal pitch.
Partial HDI: A Complete Solution
10/10/2024 | I-Connect007 Editorial TeamWe recently spoke with IPC instructor Kris Moyer about partial HDI, a process that’s recently been growing in popularity. Partial HDI allows designers to escape route out from tight-pitch BGAs on one layer, where a mechanically drilled plated through-hole is not an option, while avoiding the complexity and expense of sequential lamination cycles. As Kris explains, this process doesn’t add much to the cost, and it’s fairly straightforward. But there are some competing signal integrity and fabrication requirements to contend with. We asked Kris to walk us through this process.