Swissbit Features Miniaturized Highly Reliable PCIe M.2 BGA SSD for Ultra-Small Industrial Applications
August 6, 2020 | SwissbitEstimated reading time: 2 minutes
Swissbit launches EN-20, a new single chip solution which offers high speed PCIe SSD performance in a 3.2cm² BGA package. The device acts as a true industrial grade SSD with up to 480GB capacity and 4 lane PCIe 3.1 / NVMe 1.3 specification. It enables high performance and high reliability for small size embedded systems, factory automation, routers and switches, Internet of Things (IoT), cloud computing, and medical systems.
The EN-20 product series features industrial grade 3D NAND supporting an ambient temperature range from -40°C to 85°C. The managed device combines high grade NAND Flash chips, a sophisticated PCIe controller and firmware that supports demanding applications. The PCIe 4 lane interface with backwards compatibility to single or dual lane system designs operates according to the latest PCIe 3.1 specification and offers high bandwidth up to 1600 MB/s for sequential read and 770 MB/s for sequential write. Random performance surpasses 145,000 / 130,000 IOPS for read and write and nearly doubles the bandwidth of SATA SSDs.
The single chip has a dimension of 16 x 20mm and a 0.8mm pitch compatible with standard PCB routing guidelines. For low power consumption without sacrificing performance, EN-20 substitutes a local DRAM cache by using the HMB (host memory buffer) feature, which uses system DRAM memory to maintain the flash translation table. Intelligent thermal management protects the long-term stability of the controller and maintains a continuous bandwidth even at highest specified temperatures. Other reliability and security features are End-to-End Data Path Protection (ETEP), AES 256 encryption, LDPC error correction with full page fail recovery and a protection against sudden power loss. Data care management adds extra protection of the stored data at high operating temperatures.
The NVMe protocol has been designed to efficiently use the bandwidth with a native nonvolatile memory command set resulting in ultra-low latency.
EN-20 offers a high performance, high reliability, cost efficient, true industrial SSD in a single BGA chip with up to 1 DWPD endurance. For even higher endurance requirements, EN-26 in full pSLC mode provides a 10-fold endurance.
EN-20 has already been successfully qualified by key industrial customers and is currently available with densities from 15 GB to 240 GB in the TLC version and with 5 GB to 80GB for EN-26. An extension to 480 / 160 GB will follow later this year.
The small size and integrated metal heat spreader allows the use of EN-20 not just as a single BGA device but also on a variety of m.2 module form factors from a tiny 2230 length to the standard 2280 variant. EN-20 also powers the soon to be introduced Swissbit G-20 CFexpress™ cards with the same extensive feature set.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
SEMI Reports Global Silicon Wafer Shipments to Rebound 5.4% in 2025, with New Record Expected by 2028
10/30/2025 | SEMIGlobal shipments of silicon wafers are projected to increase 5.4% in 2025 to 12,824 million square inches (MSI) followed by steady growth through 2028 when the market is expected to reach a new industry record of 15,485 MSI, SEMI reported in its annual silicon shipment forecast.
productronica 2025: iTAC Presents AI-supported Knowledge Platform for Connected Production
10/29/2025 | iTAC Software AGIn modern manufacturing facilities, valuable knowledge is stored in systems, documents, and the minds of employees – often fragmented, isolated, and not centrally available.
Unlocking the Promise of AI in Electronics Manufacturing
10/29/2025 | Shobhit Agrawal, Keysight TechnologiesThe electronics manufacturing industry is rapidly evolving as more complicated products are introduced in the production lines, which require technological advancements even in the production processes. The requirements for production that is efficient, product quality that is greater, and product life cycles that are shorter are more crucial than ever before. In the electronic device life cycle, from design to maintenance, test phases have a significant impact on the economy of the company. Test processes are closely linked to the production volume and impacted by the complexity of the product. For businesses to maintain their competitive edge, they need to adopt innovative solutions and redefine processes.
Better Sustainability Policies for Electronics
10/29/2025 | Diana Radovan, Global Electronics AssociationI joined the Global Electronics Association in August 2025 as the director of sustainability policy. Since then, much has happened in terms of geopolitics and in the development and re-envisioning of sustainability policies in the industry. While the European Commission has released several legislative packages to simplify sustainability requirements (“omnibus”), these developments haven’t yet settled and are not in effect. Given the many recent and ongoing public consultations, with often conflicting input from a broad range of stakeholders, final negotiations remain rather polarized among policymakers.
SEMI Reports Global Silicon Wafer Shipments to Rebound 5.4% in 2025, with New Record Expected by 2028
10/29/2025 | SEMIGlobal shipments of silicon wafers are projected to increase 5.4% in 2025 to 12,824 million square inches (MSI) followed by steady growth through 2028 when the market is expected to reach a new industry record of 15,485 MSI, SEMI reported today in its annual silicon shipment forecast.