Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Indium Promotes Chris Bastecki to Business Unit Vice President

09/11/2026 | Indium Corporation
Indium Corporation is pleased to announce the promotion of Chris Bastecki to Business Unit Vice President, Americas Sales & Service and Global Printed Circuit Board (PCB) Assembly Materials Marketing.

Evaluating Physical Process Parameters to Improve Copper Plating Distribution

09/11/2026 | Richard Nichols and Marko Mirkovic, GreenSource Engineering
Consistent copper thickness across panels directly affects etching accuracy, conductor geometry, electrical performance, and ultimately, product reliability. It is a persistent manufacturing challenge, and for PCB fabricators serving advanced markets—including RF applications, power electronics, and other high-performance technologies—electrolytic copper plating is one of the most critical process steps. In response, manufacturers typically modify shielding, rectification, or tooling, which may require an expensive hardware change.

MacDermid Alpha Addresses Growing Demands for Electronics Reliability and Manufacturing Performance at Productronica India 2026

09/10/2026 | MacDermid Alpha
MacDermid Alpha Electronics Solutions will highlight advanced materials engineered to improve reliability, process consistency and performance in increasingly complex electronics applications at Productronica India 2026, September 16-18, at the Bangalore International Exhibition Centre in Bengaluru.

Koh Young America’s Ray Welch Marks 100th Advanced Solder Paste Inspection and Print Process Training Class

09/10/2026 | Koh Young Technology
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, is celebrating an important customer training milestone as Ray Welch, Sr. Applications Engineer at Koh Young America, recently delivered his 100th SPI Level 2 Print Process training class.

Real Time with... THECA 2026: Thailand's Electronics Industry Growth and Challenges

09/10/2026 | Real Time with... THECA
Expressing pride in this year's THECA event and some of the challenges encountered in putting together the important event, Phutana Daoruang, general manager of THPCA, discusses the rapid growth of Thailand's PCB, EMS, and chip packaging industries and the critical workforce shortage. He also outlines strategic initiatives to address these challenges and foster industry development.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in