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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/10/2026 | Michelle Te, I-Connect007
This week, I’ve been enjoying time with all my young adult children and our 2-year-old grandson. He is a bundle of energy, curiosity, opinions, and above all else, joy. Little children are constant reminders to stop and appreciate all the beauties of life in their most simplest form. I think that’s one reason Dan Beaulieu’s column this week resonated with me so much. Life is serious, business is serious, solving problems is serious. But how we approach these parts of our lives matters. Dan reminds us that we can do important work with joy. Strong businesses recognize that culture is a strategic asset, not a nice-to-have. People perform better when they find purpose and satisfaction in what they do.

Rehm Thermal Systems Sets New Standards in Efficient UV LED Drying with RDS UV LED

07/08/2026 | Rehm Thermal Systems
UV LED technology is becoming a key technology for electronics manufacturing when conformal coatings, adhesives or potting compounds need to be cured quickly, reproducibly and energy-efficiently. With the RDS UV LED, Rehm Thermal Systems transfers the advantages of modern LED radiation sources into a compact oven concept suitable for inline production.

ERP, Automation, and Maturity: A Systems Framework for Manufacturers

07/08/2026 | Scott Ryan, Cetec ERP
One unique opportunity for ERP consultants is to see how manufacturers operate. They can see how businesses adopt, stretch, patch, or replace systems to manage growth, customer requirements, inefficiency, or pressure on the bottom line. The insight is important to what business maturity looks like. ERP matters because it becomes the foundation for shared processes and data. It organizes how information moves, departments interact, work is measured, and how well an SMB manufacturer can scale.

Designers Notebook: Old vs. New School System-level Packaging—Flip-Chip to Chiplets

07/08/2026 | Vern Solberg -- Column: Designer's Notebook
The electronics industry has experienced a renaissance in semiconductor package technology, driven by the need to maximize electronic product functionality while minimizing the area reserved for component mounting and interconnects. Passive surface mount components are relatively small, while the packaged semiconductor die is significantly larger than the tiny die element it encases. The plastic-packaged semiconductor, although suitable for use on PCBs, is far too bulky for those developing electronics that require miniaturization: new product introduction systems for physically stressful operating conditions, such as aeronautics, military ordinance, and space missions.

Celestica Announces Leadership Transition in its Connectivity and Cloud Solutions Segment

07/06/2026 | Celestica
Celestica Inc., a global leader in data center infrastructure and advanced technology solutions, announced the appointment of Steven Dorwart to President, Connectivity and Cloud Solutions (CCS), effective July 6, 2026.
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