DuPont’s Bryan Barton Named Kavli Foundation Emerging Leader in Chemistry Lecturer
August 6, 2020 | DuPontEstimated reading time: 1 minute
Bryan Barton, Ph.D., has been selected to present The Kavli Foundation Emerging Leader in Chemistry Lecture at the American Chemical Society (ACS) Fall 2020 Virtual Meeting & Expo. The meeting will take place Aug. 17-20 with the theme of “Moving Chemistry from Bench to Market.”
Barton is a research group leader at DuPont Electronics & Imaging, where he leads a team developing new materials for chemical mechanical planarization (CMP), a key process in semiconductor fabrication. In his lecture, “Innovator’s Guide to Industrial Impact,” he will share learnings from his recent work at DuPont developing novel polyurethane chemistries for the semiconductor industry, as well as prior work at The Dow Chemical Company in which he developed a carbon-fiber manufacturing process for the automotive industry.
“Leading an R&D group at DuPont, my team is able to deliver innovative solutions that meet our customers’ emerging needs, and technical success also corresponds to a strong commercial and industry impact,” Barton said. “I’m sincerely honored to be selected for the Kavli Foundation lectureship and look forward to sharing perspectives on industrial innovation during the ACS Fall Meeting.”
Barton earned his bachelor’s degree in chemistry at Millikin University and his doctorate in chemistry at the University of Illinois at Urbana-Champaign.
The Kavli Foundation Emerging Leader in Chemistry lectureship is awarded to an outstanding early career chemical scientist who is highly regarded by his or her peers for significant contributions to an area of chemistry or a multidisciplinary area of chemistry.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/12/2025 | Marcy LaRont, I-Connect007We may be post-Labor Day, but it is still hot-hot-hot here in the great state of Arizona—much like our news cycles, which have continued to snap, crackle, and pop with eye-raising headlines over this past week. In broader global tech news this week, AI and tariff-type restrictions continues to dominate with NVIDIA raising its voice against U.S. lawmakers pushing chip restrictions, ASML investing in a Dutch AI start-up company to the tune of $1.5 billion, and the UAE joining the ranks of the U.S. and China in embracing “open source” with their technology in hopes of accelerating their AI position.
IPS, SEL Raise the Bar for ENIG Automation in North America
09/11/2025 | Mike Brask, IPSIPS has installed a state-of-the-art automated ENIG plating line at Schweitzer Engineering Laboratories’ PCB facility in Moscow, Idaho. The 81-foot, fully enclosed line sets a new standard for automation, safety, and efficiency in North American PCB manufacturing and represents one of the largest fully enclosed final finish lines in operation.
Dan Feinberg on Walt Custer: Remembering an Extraordinary Business Associate and Friend
09/09/2025 | Dan Feinberg, Technology Editor, I-Connect007The passing of Walt Custer marks the end of an era for all those who knew him and were helped and impressed by his presence, both personally and professionally. Walt's life was characterized by his unwavering commitment to the industry, his profound wisdom and willingness to share it, and his infectious enthusiasm for everything he did.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.