Digi-Key Electronics Partners for Global Distribution with Septentrio
September 2, 2020 | Digi-Key ElectronicsEstimated reading time: 1 minute
Digi-Key Electronics, a global electronic components distributor, announced that it has partnered with Septentrio, a leader in high-precision GNSS positioning solutions. Digi-Key now offers mosaic-X5™ globally for customers who need secure and reliable high-accuracy positioning in a compact and low-power form factor.
Septentrio's mosaic-X5 features complete multi-frequency multi-constellation technology and tracks every existing and future signal from all Global Navigation Satellite System (GNSS) constellations. Such signal diversity coupled with advanced anti-jamming technology allows mosaic-X5 to deliver centimeter-level positioning with maximum availability even in challenging industrial environments. This makes mosaic-X5 an ideal positioning solution for applications such as robotics, automation, telematics and many more.
"Our mosaic-X5 is an advanced GNSS receiver module without performance compromises. With its small form factor and low-power design, mosaic-X5 brings high-performance positioning to volume applications," said Francois Freulon, head of product management for Septentrio. "Having Digi-Key as a distributor enables us to scale and reach out to find new markets and applications where secure high accuracy positioning is required."
"Digi-Key is excited about the new partnership with Septentrio," said David Stein, vice president of global supplier management for Digi-Key. "Demand for high-accuracy GNSS receivers with secure and robust positioning is growing strongly, as they continue to be implemented into new applications and devices. Digi-Key offers customers an easy path to order, develop, and deploy with the latest technologies available, including Septentrio's robust and precise GNSS devices, which have the latest anti-jamming and anti-spoofing technology."
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.