Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
Atotech to Present at SMTA International 2020
September 16, 2020 | AtotechEstimated reading time: 1 minute
Atotech, a global supplier of specialty chemicals, equipment, and service, is pleased to announce its participation in the upcoming SMTA International. The on-demand conference and virtual exhibition will be held from September 28 through October 23, 2020.
Atotech’s Global Product Manager Selective Finishing, Dr. Britta Schafsteller, will give a technical paper presentation entitled “ENIG – Corrosion: When does it get critical and how is the status in the PCB industry?” as part of the Substrates/PCB Technology (SUB) track. Britta’s presentation will be available for viewing during the entire time the conference is open.
Visitors to the show are invited to watch Britta’s presentation to learn more about influences for ENIG corrosion as well as corrosion rating for gold electrolytes.
For more information about Atotech or its product offering, please visit www.atotech.com or contact us at: info@atotech.com.
About Atotech
Atotech is a global leader in surface-finishing solutions. Through a comprehensive systems-and-solutions approach, the company delivers chemistry, equipment, and service to support diverse industries such as consumer electronics, especially mobile devices and computing; global automotive; communication infrastructure; and many other industrial end-markets. Atotech’s relentless R&D efforts and global TechCenter presence allows it to deliver pioneering and sustainable products combined with unparalleled on-site customer support – making Atotech a critical partner to over 8,000 customers worldwide.
Atotech, headquartered in Berlin, Germany, is a team of 4,000 experts in over 40 countries generating annual revenues of $1.2 billion (2019). Atotech has manufacturing operations across Europe, the Americas, and Asia.
Share on:
Suggested Items
Real Time with... electronica 2024: Inside CEE PCB—Innovations in Technology
11/22/2024 | Real Time with... electronicaMarcy LaRont Interviews Tom Yang and Jerome Larez From CEE PCB. Tom and Jerome showcase the company's advancements and emphasize the importance of automation in PCB manufacturing for quality and efficiency. The CEE PCB focuses on sustainability and aims to connect with high-tech clients while exploring new partnerships for high-volume production.
Sat Nusapersada Chooses Siemens' Process Preparation Software to Boost NPI and SMT Line Efficiency
11/21/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software announced that Sat Nusapersada, one of the largest Electronics Manufacturing Services (EMS) providers in Indonesia, has adopted its Process Preparation software to reduce its timescale for New Product Introduction (NPI) of printed circuit board assemblies and improve the efficiency of its Surface Mount Technology production lines by 23 percent.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
Foxconn to Build AI Factories with NVIDIA Omniverse Platform
11/20/2024 | FoxconnFoxconn announced it is collaborating with NVIDIA to build digital twins to reshape the future of manufacturing processes and supply chain management while opening new pathways for global deployment of advanced facilities and enhancing corporate resilience.
Indie Semiconductor Extends Automotive Photonics Leadership with Advanced Optical Component Integration Capabilities
11/20/2024 | indie Semiconductorindie Semiconductor, an automotive solutions innovator, has extended its photonics offering with the addition of in-house photonics integration, packaging and system test capabilities.