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Advanced Electronics Packaging Digest

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Qnity Joins PHLX Semiconductor Sector Index (SOX)

09/22/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced that it has been added to the PHLX Semiconductor Sector Index (SOX).

AT&S, Marvell Expand Collaboration for Next-Gen AI Infrastructure

09/22/2026 | AT&S
AT&S announced an expanded collaboration with Silicon Valley company Marvell Technology, a leading provider of data infrastructure semiconductor solutions, to increase advanced IC substrate capacity for next-generation AI and cloud infrastructure.

Sparton Rebrands as Twenty-Six Defense Maritime to Advance U.S. Maritime Defense

09/18/2026 | Twenty-Six Defense Maritime
Sparton DeLeon Springs, LLC (Sparton), and Logos Technologies are now operating as Twenty-Six Defense Maritime. The new name reflects the company’s continued evolution and its commitment to delivering U.S.-built technologies that have strengthened America’s national security for more than a century.

TFE Acquires TEKENA USA, Expanding Particle Removal and Surface Cleaning Portfolio

09/16/2026 | TFE
TFE, a North American provider of manufacturing equipment, consumable products and technical solutions, announced the acquisition of TEKENA USA LLC, a provider of particle removal and surface cleaning technologies for precision manufacturing applications.

Spirox Launches High-Speed TGV Crack Inspection System to Support High-Volume Glass Substrate Inspection

09/16/2026 | PRNewswire
Spirox, hosted the Advanced Packaging Technology Forum, bringing together experts from Corning and DNP to share insights on Glass Core, TGV, reliability, and inspection technologies for next-generation AI and HPC applications.
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