It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Alpha Insights, Performance by Design: The Future of PCB Manufacturing in the Midwest
Happy’s Tech Talk #43: Engineering Statistics Training With Free Software
Qualcomm Snapdragon XR2 Platform Commercially Debuts in Oculus Quest 2
September 16, 2020 | Qualcomm Technologies, Inc.Estimated reading time: 2 minutes
Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, is powering better-than-ever virtual reality (VR) gameplay and experiences with the launch of Oculus Quest 2, the first-to-launch VR device powered by the QualcommÒ Snapdragon™ XR2 Platform. Oculus Quest 2 is a culmination of years of collaboration between Qualcomm Technologies and Facebook to create the most advanced and immersive gaming VR experiences for consumers to-date.
Purpose-built for extended reality (XR), the Snapdragon XR2 Platform unlocks staggering improvements including twice the CPU and GPU performance compared to its predecessor[1] which powers the original Oculus Quest headset. The Snapdragon XR2 Platform delivers significant performance enhancements in Oculus Quest 2 including:
Powering the highest resolution display yet in any Oculus headset, with 50% more pixels than the original Oculus Quest headset.
Delivering more than 11x the AI processing than its predecessor[2], the Snapdragon XR2 Platform allows more perception algorithms to work concurrently with the many other tasks, resulting in more immersive experiences for the end user.
Incorporating the Engine for Visual Analytics (EVA) computer vision dedicated processor which helps to offload key VR-related tasks for tracking to enable low latency and reduce overall power consumption.
Cutting-edge heterogenous compute architecture that is designed to help preserve Oculus Quest 2 battery life of 2-3 hours of playtime meaning users can have even better VR experiences on the same charge.
Premium Wi-Fi 6 performance of the Qualcomm® FastConnect™ 6800 connectivity system that enables Oculus Quest 2 to achieve truly wireless VR with faster download speeds.
“We built the Snapdragon XR2 Platform from the ground up and designed it to push the boundaries of what is possible in XR and enable our customers to create a new generation of experiences and devices,” said Hugo Swart, VP and head of XR, Qualcomm Technologies, Inc. “Qualcomm Technologies’ worked closely with the team at Facebook to enhance and tailor the Snapdragon XR2 feature-set in Oculus Quest 2 and today marks an incredible milestone in VR. We look forward to our continuous collaboration with Facebook to offer the best possible, all-in-one VR experiences to the mass consumer.”
With a deep catalog of premium and unique gaming experiences at the heart of Oculus Quest 2, the product also provides a variety of engaging non-gaming experiences for all to enjoy, including fitness apps, unique entertainment and social places to connect with friends. It’s also helping to redefine the future of work with enterprise and productivity applications that can transform collaboration and training, despite distance.
“For Facebook, this collaboration represents our commitment to accelerating the VR industry,” said Rafael Camargo, VP of Hardware for Facebook Reality Labs. “We won’t just wait for the key technologies that power next-gen VR experiences to develop over time. We want to be part of defining the future and helping it to move faster, and we’re proud to be doing this hand-in-hand with our innovative partners at Qualcomm Technologies.”
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Dymax to Address Key Electronics Assembly Challenges with Light-Cure Solutions at SMTA International 2025
10/09/2025 | DymaxDymax, a global manufacturer of light-curing materials and equipment, will exhibit at SMTA International 2025 in Rosemont, Illinois, October 21–23. Visit booth 2834 to see how Dymax technologies protect components from harsh environments, help meet regulatory requirements, and streamline assembly.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
The Power Integrity Issue: Design007 Magazine October 2025
10/08/2025 | I-Connect007 Editorial TeamAs technologies such as chiplets and 3D-IC continue to proliferate, solid knowledge of PI design techniques will become a critical tool in your toolbox. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
AT&S Plans Entry Into the Defense Sector
10/02/2025 | AT&SIn times of global uncertainty and geopolitical tension, AT&S is expanding its portfolio to include the defense sector. As a globally leading provider of high-end IC substrates and printed circuit boards, the company is responding to growing demand for security-relevant solutions and emphasizing its social responsibility. This demand will be addressed from its site in Leoben, Austria.
Insulectro Promotes Chris Hunrath to Chief Technology Officer
09/29/2025 | InsulectroInsulectro, the largest distributor of materials used in the manufacturing of printed circuit boards and printed electronics, has promoted longtime employee Chris Hunrath to Chief Technology Officer (CTO).